TSMC will develop AI chip packaging technology

According to The Information, TSMC (TSM.N) will develop AI chip packaging technology.

In the past, packaging has been regarded as a relatively conventional process in semiconductor manufacturing, but with the surge in AI demand, chip design companies need to integrate more processors and high-bandwidth memory into increasingly large and complex packages. Advanced packaging has become one of the industry's most critical bottlenecks. Intel has developed a packaging technology called Embedded Multi-Die Interconnect Bridge (EMIB).

This technology uses small silicon bridges to establish high-speed connections between processors and memory, enabling support for larger-scale multi-chip designs, thus creating more powerful AI chips and helping chip designers achieve supply chain diversification, which has attracted the attention of potential customers such as NVIDIA (NVDA.O).

Insiders say that within TSMC, engineers refer to this advanced packaging project as "EMIB-like" and have discussed this solution with some customers.