NVIDIA announces the mass production of Co-Packaged Optics (CPO), related concept stocks may see a rebound

Gilad Shainer, Senior Vice President of NVIDIA, announced at a recent technology forum that CPO has entered the mass production stage. The switches co-developed with the supply chain have begun delivery to closely collaborating customers and are being deployed in-house. It is expected that starting this year, switches equipped with CPO technology will be widely adopted in AI factories around the world.

Shainer pointed out that the biggest opportunity in the future optical communication market lies in vertical scaling, which will require bandwidth efficiency more than ten times that of horizontal scaling. Previously, Shainer was responsible for R&D at Mellanox, and after the company was acquired by NVIDIA, he led the AI platform network transmission department and co-developed the COUPE silicon photonics packaging platform with TSMC. This announcement helps to dispel market concerns about the upgrade of optical communication specifications and boosts the operational outlook for related manufacturers.

It is reported that NVIDIA has already implemented CPO on Spectrum-X, aiming to align with the upcoming large-scale deployment of the Vera Rubin AI platform (which has a computing speed at least three times faster than GB300). Trendforce estimates that the CPO/NPO market size will exceed $39 billion by 2030, with significant acceleration in growth momentum from 2028 to 2029 as optical interconnects are introduced with Scale-up.