NetEase incubates Qianhe Yibang's global first 4-layer 3D DRAM stacked compute-in-memory chip successfully powered on

On August 21, 3D storage-computing integrated chip company Qianhe Yibang announced that its self-developed global first 4-layer 3D DRAM stacked storage-computing integrated chip successfully returned to the wafer and was powered on, marking the transition of this technology from validation to the engineering implementation stage. This chip adopts a three-dimensional integrated native computing architecture, with data access and storage bandwidth improved by an order of magnitude compared to traditional solutions, while access and storage power consumption, latency, and single data processing costs have all decreased by an order of magnitude.

Qianhe Yibang was established in January 2024, incubated by NetEase, and recently completed over 2 billion yuan in Series B financing.