SK Hynix considers Intel as the next-generation HBM substrate chip supplier

According to Citrini analyst Jukan, SK Hynix is working on diversifying the foundry suppliers for the substrate chips used in high bandwidth memory (HBM), which are constructed by vertically stacking multiple memory chips. It is reported that the company is considering outsourcing part of the substrate chip production for the seventh generation HBM, namely HBM4E, to Intel's foundry. So far, SK Hynix has relied entirely on TSMC for outsourcing substrate chip production.

This move is seen as an effort to establish a multi-supplier foundry strategy to reduce the concentration of the supply chain on TSMC while enhancing SK Hynix's bargaining power in pricing. According to industry insiders on August 31, SK Hynix is advancing a plan where the substrate chips for HBM4E may be jointly manufactured by TSMC and Intel, potentially starting from the HBM4E generation.

As the market expects the cost burden of substrate chips for HBM4E to further increase. Since HBM products are mainly covered by long-term supply agreements (LTA), SK Hynix also finds it difficult to immediately pass on the higher foundry costs to customers by raising product prices. Therefore, industry observers believe that if Intel ultimately joins SK Hynix's substrate chip supply chain, the company will gain more options in terms of cost competitiveness and supply stability.