Changdian Technology plans to raise 6.5 billion yuan to expand AI packaging capacity

On September 7, China's leading packaging and testing company Changdian Technology announced plans to raise no more than 6.5 billion yuan (approximately 968 million USD) through a private placement of shares, aimed at expanding advanced packaging capacity for AI chips and related technology research and development.

The funds raised will primarily be directed towards the construction of production lines for high-density system-in-package and wafer-level packaging aimed at AI computing chips, in response to order demands from clients such as NVIDIA and AMD. Changdian Technology stated that the bandwidth and heat dissipation requirements for packaging technology have significantly increased for AI chips, and existing capacity is nearing full operation. This fundraising plan still requires approval from the shareholders' meeting and regulatory authorities.