MediaTek released the Dimensity 9600 Pro: 2nm process with over 33 billion transistors

On September 15, MediaTek announced the next-generation flagship chip, Dimensity 9600 Pro, at the 2026 Dimensity flagship product launch event. According to the official introduction, this chip is manufactured using TSMC's 2nm process, with over 33 billion transistors.

The chip adopts a heterogeneous computing architecture that integrates CPU, GPU, NPU, ISP, and other computing cores, with AI as the core engine. It features an all-large-core architecture, equipped with dual super-large cores C2-Ultra at 4.55GHz, three large cores C2-Pro at 4.35GHz, and three large cores C2-Pro at 3.1GHz, along with 34.5MB of L2+L3+system cache, supporting LPDDR6 memory and UFS 5.0 flash storage. Compared to Dimensity 9500, the power consumption of the super-large cores has decreased by 37%, and the multi-core power consumption has decreased by 61%.

In GeekBench V6.4, it scored 4276 points in single-core and 12650 points in multi-core, representing an improvement of about 17% in single-core and about 15% in multi-core compared to Dimensity 9500. The NPU adopts a dual NPU architecture, equipped with APU 1090, with peak performance improved by 51%. MediaTek claims to have maintained the number one position in global smartphone SoC market share for six consecutive years.