TSMC N2 mass production, Zhongsha Shengyang Semiconductor and other supply chains benefit

TSMC's 2-nanometer N2 mass production marks the transition of advanced semiconductor processes from FinFET to GAA generation. Industry analysts point out that with the simultaneous increase in process complexity, CMP track counts, wafer monitoring frequency, and material specifications, the demand for equipment, CMP consumables, reclaimed wafers, and advanced materials is rising, providing growth opportunities for suppliers like Zhongsha, Shengyang Semiconductor, Xinying Materials, and Songsheng. TSMC's N2 adopts nanosheet GAA technology, which can improve performance by 10% to 15% at the same power consumption compared to N3E, or reduce power consumption by 25% to 30% at the same speed, with chip density increasing by over 15%.

In Zhongsha's largest customer Diamond Disk business, advanced processes account for 63%, with N3 and N2 each accounting for 22%, and 1.4 nanometers already shipped in small quantities; after N3 enters N2, the value of CMP content increases by 10% to 15%. Shengyang Semiconductor's monthly production capacity for reclaimed wafers is adjusted to 1.1 to 1.2 million pieces by the end of 2026, with a capital expenditure budget of 4.82 billion yuan for 2026, and it is estimated that the compound annual growth rate for reclaimed wafer expansion from 2025 to 2029 will reach 25% to 30%. Xinying Materials' core products Rinse, BARC, and EBR are expected to see shipments rise seasonally as N2 capacity ramps up, while Songsheng's semiconductor revenue accounted for 66% in the first half of the year, with a year-on-year increase of about 25%, and TSMC-related revenue increased by about 170% year-on-year.