Ming-Chi Kuo: NVIDIA tests fiberglass-free copper-clad laminates

Tianfeng International Securities analyst Guo Mingqi published that his latest supply chain check shows that NVIDIA has begun testing fiberglass-free copper-clad laminates primarily made of hydrocarbon resin to replace the previously tested fiberglass-free PTFE copper-clad laminates, along with fiberglass-free hydrocarbon prepregs. The test aims to confirm whether this combination can meet the requirements of the Rubin Ultra NVL576 exchange tray PCB. NVL576 is an eight-rack interconnection solution expected to enter mass production in the second half of 2027.

Guo Mingqi stated that preliminary tests conducted to enhance PCB manufacturability show that the fiberglass-free hydrocarbon copper-clad laminate has met the high-frequency electrical requirements of the exchange tray. Its electrical performance lags behind the original PTFE solution but is better than the M9 level solution and exceeds the M10 published specifications. This result does not represent the final material selection, indicating that NVIDIA is still seeking higher PCB manufacturing yields and production efficiency while meeting electrical requirements.

Guo Mingqi mentioned that Shengyi Technology is currently the leading supplier for the NVL576 exchange tray material evaluation, with related materials including fiberglass-free PTFE copper-clad laminate SG5300N, fiberglass-free hydrocarbon copper-clad laminate SG1030N, and fiberglass-free hydrocarbon prepreg SIF09. SG1030N and SIF09 still contain a small amount of PTFE. He also stated that once specifications are confirmed and mass production begins, Shengyi Technology is expected to accelerate procurement from Chinese hydrocarbon material suppliers such as Dongcai, Shengquan, and potential supplier GCH Technology.