AMD CEO Lisa Su visits Samsung again, stating that they will discuss broader cooperation

AMD Chairwoman and CEO Lisa Su arrived at Samsung Electronics' Seocho office building in Seoul at around 4:44 PM on October 7, meeting with Vice Chairman Choi Yong-hyun, head of the Device Solutions Division, approximately seven months after her last visit to South Korea. Jack Huynh, head of AMD's Computing and Graphics Group, and Vice President Joseph Macri accompanied her. Lisa Su stated that both sides would discuss a broader partnership and mentioned that Samsung has many partners; when asked if she would meet with Lee Jae-yong, she said it was inconvenient to disclose.

Before visiting Samsung, Lisa Su attended AMD Player Day in Seoul, referring to Samsung and SK Hynix as core supply chain partners and stating that they are planning a long-term supply chain due to rising demand for artificial intelligence. She mentioned that the next-generation MI455 and Helios systems have begun shipping and both use HBM4, supported by two companies, and that the HBM collaboration will not stop at one generation. Reports indicate that the Instinct MI455X features 432GB of HBM4, an increase of 50% compared to the previous generation MI355X's 288GB of HBM3E. She noted that memory supply is very tight and that they are optimizing usage with customers and asking partners to expand production. TrendForce predicted on the 29th of last month that the limited advanced process capacity shared between HBM and regular DRAM may continue to lead to tight supply into next year.

Reports state that both parties signed a memorandum of understanding in March this year centered on the supply of HBM4 and next-generation DDR5, designating Samsung as the main supplier of HBM4 for the MI455X and discussing Samsung's contract manufacturing of AMD's next-generation products. Choi Yong-hyun stated at that time that Samsung can provide memory, foundry, and packaging simultaneously.