Samsung will collaborate with TSMC to produce NVIDIA memory chips

Samsung Electronics will adopt TSMC's 3-nanometer process to produce the next generation of custom HBM chip bare dies for NVIDIA. This is the first time Samsung has collaborated with TSMC in the HBM manufacturing stage.

NVIDIA has requested Samsung, SK Hynix, and Micron Technology to use TSMC's process to manufacture NVHBM bare dies and to utilize sixth-generation DRAM technology. Samsung plans to continue independently producing standard HBM and custom products for other customers.