TSMC CoWoS price quotes are reported to be raised, with an increase of up to 20%

According to the Industrial and Commercial Times, the supply chain reveals that TSMC's CoWoS pricing is brewing a new wave of increases, with an increase of up to 20%. Some packaging delivery times have already been extended, and the pressure from tight capacity continues to rise. The rush for capacity has spread to the equipment side, and customers have no time to negotiate prices; as long as they can promise delivery times, they place orders, with equipment delivery times extending to a maximum of 8 months.

Chip manufacturers point out that the demand for advanced packaging has spread from AI GPUs to server CPUs and customized ASICs, with unfulfilled orders continuing to increase. The testing time for AI chips has lengthened, putting pressure on the synchronization of packaging and testing capacity. Wafer foundries and packaging testing companies are preparing to adjust CoWoS pricing, estimating an increase of 10% to 20%. Equipment manufacturers reveal that TSMC has not renegotiated prices this year, directly purchasing at original prices without any increase in equipment functionality, with equipment delivery times extending from the past 3 to 6 months to 6 to 8 months.

TSMC Chairman C.C. Wei stated at the recent earnings call that CoWoS remains the first choice for customers, with five-fold photomask size packaging already in mass production, and the development of nine-fold and fourteen-fold photomask size solutions is ongoing, while advancing CoPoS technology. Analysts estimate that by 2026, CoWoS monthly production capacity will advance to over 130,000 pieces, aiming for 200,000 pieces by 2027; related layouts include Chiayi AP7, Tainan AP8, and AP6, with the advanced packaging plant in the U.S. AP1 planned to start production in 2028.