TSMC is reportedly planning to acquire two factories from AUO in Zhongke, with an amount exceeding 30 billion New Taiwan dollars
According to the Economic Daily News, there are market rumors that TSMC plans to acquire AUO's L7 plant (7.5 generation line) and L5C plant (5 generation line), with the transaction amount estimated to exceed 30 billion New Taiwan Dollars (approximately 920 million USD). Both parties are negotiating based on the "Innolux model," and TSMC has sent personnel for on-site audits but has not yet signed a contract announcement. The AUO Zhongke plant is adjacent to TSMC's Zhongke No. 15 plant, providing geographical advantages.The report states that TSMC plans to use CoPoS technology as the next generation of 2.5D advanced packaging after CoWoS, introducing panel-level glass substrate packaging through "transforming round into square" to address the area waste and warping issues of ultra-large AI chips on 12-inch wafers. TSMC's first CoPoS production line has been completed and launched at the Chiayi AP7 plant. Industry insiders believe that panel manufacturers possess experience in handling large substrates and managing production lines, making them providers of "intermediate layer capabilities" for the mass production of advanced packaging.
