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BNB $742.79 -0.41%
XRP $1.39 -0.84%
SOL $103.22 -1.74%
TRX $0.3348 -0.19%
DOGE $0.0898 +0.65%
ADA $0.2183 -0.54%
BCH $258.52 +1.21%
LINK $12.63 -2.99%
HYPE $84.04 -2.68%
AAVE $130.99 -1.98%
SUI $0.8261 +3.95%
XLM $0.1894 +1.23%
ZEC $1,129.00 -4.97%

Tencent has applied for a patent for blockchain transaction packaging

2024-02-27 12:41:08

ChainCatcher news, according to a report by Financial界, the National Intellectual Property Administration announced that Tencent Technology (Shenzhen) Co., Ltd. has applied for a patent named "Blockchain Transaction Packaging Method, Device, Equipment, Storage Medium and Program Product," with publication number CN117609361A, and the application date is October 2023.

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