The industry claims that the DRAM capacity for 2027 has been sold out in advance, with HBM accounting for nearly 70% of DRAM capacity

According to DIGITIMES, industry insiders revealed that the three major memory manufacturers have completed the capacity allocation negotiations for the entire year of 2027 in advance, with both DRAM and HBM capacities sold out. In terms of NAND Flash, although it is not as tight as DRAM, it is expected that the capacity will also be fully booked by the end of August 2026. ADATA Chairman Chen Libai confirmed that applications related to HBM and AI servers will account for nearly 70% of DRAM capacity, while the supply of DRAM for PCs and mobile phones will be relatively limited.

Industry assessments indicate that Samsung, Micron, and SanDisk's NAND capacity for the entire year of 2027 has also been pre-sold, with Kioxia and SK Hynix expected to confirm by the end of August. SK Group Chairman Chey Tae-won previously stated that the demand for AI semiconductors in 2027 is expected to increase by 60-100% compared to 2026, with storage demand expected to grow by 50-60%, leading to a potential widening of the supply-demand gap and possibly facing "the most severe shortage in history." Industry insiders pointed out that the capacity allocation model is more orderly compared to 2026, but the amount that manufacturers can provide is usually only 60-70% of customer demand, leaving some small and medium buyers still facing the dilemma of having no products to purchase. The price increase of memory may slow down in 2027, but remaining high could become the norm.