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hot_img TrendForce: DRAM supply tightness will continue until 2027, Nvidia assesses and lowers Rubin Ultra HBM configuration

According to the latest research by TrendForce, the tight supply of DRAM is expected to continue until 2027, and the uncertainty of the HBM4e verification schedule is prompting AI chip manufacturers to consider reducing the HBM configuration of their next-generation products. Starting from Q3 2026, NVIDIA has begun evaluating the HBM solution for Rubin Ultra, expanding from the original 12-Hi HBM4e to alternative options such as 8-Hi HBM4e, 12-Hi HBM4, and 8-Hi HBM4, with the final specifications yet to be determined. Previously, due to the expected supply bottleneck of LPDDR5X lasting until 2027, NVIDIA decided to halve the SOCAMM capacity of the next-generation Vera Rubin Superchip module.TrendForce pointed out that the main reasons for the downgrade of Rubin Ultra from 12-Hi HBM4e include: the overall DRAM shortage in 2027 will limit the allocation of wafer capacity to HBM, and there is still uncertainty regarding the mass production schedule and yield ramp-up of 12-Hi HBM4e. It is expected that the HBM bit shipment volume in 2027 will increase by approximately 50-60% year-on-year, which will still be insufficient to meet the growth in demand. HBM suppliers will maintain pricing power throughout 2027, and HBM prices are expected to rise significantly. The final configuration will depend on the wafer allocation decisions of memory suppliers.

Changxin Memory is considering building a second DRAM wafer factory in Beijing and is in talks for financing support

According to Reuters, informed sources say that Changxin Storage is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang and is negotiating financing with the Beijing Economic and Technological Development Zone and several state-owned technology companies. The company is seeking at least 60 million yuan (approximately 8.9 million USD) in support, but negotiations are still in the early stages, and the scale and structure of the financing may be adjusted.The proposed factory will be located at the site of Changxin Storage's existing DRAM wafer fab in Beijing. The planned production capacity and total investment for the project have not yet been determined, while building a fab capable of producing advanced DRAM typically requires over 10 billion USD. Currently, Changxin Storage operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. Changxin Storage is also building new factories in Shanghai and Hefei, and once the related projects are fully operational, the company's monthly production capacity could double to over 600,000 wafers.This expansion comes as demand for storage chips is driven by AI infrastructure, data centers, and consumer electronics entering an upward cycle. The company completed an 8.6 billion USD IPO last month, marking the largest fundraising for a semiconductor company listed in mainland China, and its stock price has risen by 13% since going public. Changxin Storage is currently the fourth largest DRAM manufacturer in the world, but Samsung Electronics, SK Hynix, and Micron together still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing funding and other support to Changxin Storage to gain economic and strategic benefits from its expansion.

hot_img The industry claims that the DRAM capacity for 2027 has been sold out in advance, with HBM accounting for nearly 70% of DRAM capacity

According to DIGITIMES, industry insiders revealed that the three major memory manufacturers have completed the capacity allocation negotiations for the entire year of 2027 in advance, with both DRAM and HBM capacities sold out. In terms of NAND Flash, although it is not as tight as DRAM, it is expected that the capacity will also be fully booked by the end of August 2026. ADATA Chairman Chen Libai confirmed that applications related to HBM and AI servers will account for nearly 70% of DRAM capacity, while the supply of DRAM for PCs and mobile phones will be relatively limited.Industry assessments indicate that Samsung, Micron, and SanDisk's NAND capacity for the entire year of 2027 has also been pre-sold, with Kioxia and SK Hynix expected to confirm by the end of August. SK Group Chairman Chey Tae-won previously stated that the demand for AI semiconductors in 2027 is expected to increase by 60-100% compared to 2026, with storage demand expected to grow by 50-60%, leading to a potential widening of the supply-demand gap and possibly facing "the most severe shortage in history." Industry insiders pointed out that the capacity allocation model is more orderly compared to 2026, but the amount that manufacturers can provide is usually only 60-70% of customer demand, leaving some small and medium buyers still facing the dilemma of having no products to purchase. The price increase of memory may slow down in 2027, but remaining high could become the norm.

hot_img Changxin Technology was listed on the Sci-Tech Innovation Board on July 27, with a valuation of approximately 580 billion yuan. The entire supply chain, including equipment, materials, and packaging testing, may benefit

Domestic DRAM storage IDM leader Changxin Technology will officially list on the Sci-Tech Innovation Board on July 27, with an issuance valuation of approximately 580 billion yuan and a total fundraising amount of 29.5 billion yuan, of which about 22.066 billion yuan is for equipment purchase and installation costs. Industry insiders believe that 2026-2027 is the golden window period for the introduction of domestic equipment.In terms of the supply chain, on the equipment side, North Huachuang has shipped a large volume of various categories such as etching and thin film deposition, Zhongwei Company continues to validate and mass-produce etching and thin film equipment, Huahai Qingshi CMP equipment has entered the core supply chain, and Jingce Electronics and Jingzhida testing equipment are benefiting simultaneously. On the materials side, Yake Technology precursor products cover advanced process needs, Guanggang Gas provides special gases and bulk gases, Jinhong Gas has a gas production order cycle of 15 years, Tongcheng New Materials ArF/KrF photoresists have entered mass production, Jingrui Electric Materials has a market share of over 40% in high-purity hydrogen peroxide, but high-end photoresists are still in the validation stage, and Debang Technology is in the sample testing stage. On the packaging and module side, Huatian Technology is a packaging supplier, Jiangbolong and Demingli have reached procurement agreements, while Maijie Technology is still in the introduction phase. On the distribution side, Shangluo Electronics has been authorized, and there are expectations for supply strategy adjustments after listing. Several listed companies hold shares indirectly through industrial funds, with Shangfeng Cement holding approximately 0.1517% of the equity before issuance.

Changxin Technology's global DRAM market share reaches 9%, with the 15% "survival line" being key to entering the top tier

According to the latest report released by market research firm Counterpoint Research, Chinese memory chip giant Changxin Technology (CXMT) currently holds a 9% share of the global DRAM market (by bit shipments), and this figure is expected to rise to 11% by 2028 (with a revenue share of 9%). The report indicates that Changxin Technology is transitioning from an industry "challenger" to a "strategic player," with a long-term goal of achieving a bit shipment share of 20% and a revenue share of 15% by 2035.However, the report emphasizes that to truly establish a foothold in the global memory market and join the ranks of the "big three DRAM manufacturers," Changxin Technology must cross the global market share threshold of 15% to 17% (about one-sixth). Historical experience shows that in 2008, Taiwanese DRAM manufacturers could not secure the massive funding needed for the research and development of the next generation of fabs after their market share fell below 15%, ultimately causing their market share to plummet to the edge of 3%. Therefore, the 15% share is seen as the core survival line for Changxin Technology to ensure sustainable development and self-sustaining capabilities in the medium to long term.To cross this threshold, Changxin Technology is leveraging newly raised funds to accelerate capacity expansion, planning to double its capacity by 2030 and triple it by 2035. Although facing external challenges such as U.S. equipment export controls and global supply chain access, analysts believe these restrictions may instead act as catalysts, forcing Changxin Technology to accelerate independent innovation in cutting-edge technologies such as Vertical Channel Transistors (VCT) and Wafer-on-Wafer bonding, thereby narrowing the gap with industry leaders.

Domestic storage chip leader Changxin Technology is open for subscription today, with the new share allotment rate soaring, possibly ushering in a "sunshine" market

The domestic DRAM storage chip leader Changxin Technology (688825) has officially opened for new stock subscription. Due to the large issuance scale, this new stock offering has rarely seen a "sunshine market" trend. Institutions predict that the online winning rate will soar to 0.3% to 0.7% (with a neutral expectation of about 0.45%), reaching 10 to 20 times that of ordinary Sci-Tech Innovation Board new stocks. Calculations show that the probability of winning for a single account with an average market value of 200,000 in the Shanghai market is as high as about 18%, and theoretically, an average market value of 1 million can reliably secure 1 winning ticket.The issuance price of the stock is 8.66 yuan per share, and to secure one winning ticket (500 shares), a payment of 4,330 yuan is required. The official winning rate and results will be disclosed on July 17 and July 20 (Monday) respectively, and winners must ensure sufficient funds in their accounts by 16:00 on the 20th. Various institutions have given a neutral expectation, as Changxin Technology's market value is expected to reach 2 trillion to 3 trillion yuan after listing, with the profit margin for a single winning ticket expected to be around 20,000 yuan.If Changxin Technology fully exercises the green shoe mechanism, the total fundraising amount will reach 66.607 billion yuan, setting a new record for the largest IPO on the Sci-Tech Innovation Board, and it will also become the third largest IPO in A-share history. Financial data shows that the company has fully turned a profit, with expected operating revenue in the first half of 2026 reaching 110 billion to 120 billion yuan, and net profit attributable to the parent company reaching 50 billion to 57 billion yuan. The total amount of this strategic placement exceeds 14.4 billion yuan, successfully attracting social security funds, pension funds, as well as 30 major industry terminal giants such as Alibaba Cloud, Tencent, Meituan, and Xiaomi.
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