CXMT has launched the equipment bidding for the new factory in Shanghai and is planning to expand production in multiple locations

China's largest DRAM manufacturer Changxin Storage (CXMT) has recently launched a bidding for equipment from partners for its new factory in Shanghai and is advancing capacity expansion in multiple locations. CXMT is currently mass-producing DRAM in Hefei Phase II and Beijing Phase I, with an estimated capacity of about 200,000 wafers per month, which may exceed 300,000 wafers per month by the end of the year.

CXMT plans to open the new factory in Shanghai in the fourth quarter of this year, and the related equipment bidding has already started. Semiconductor equipment industry insiders say that the factory is planned to be expanded in two phases, with capacity significantly exceeding 100,000 wafers per month. Subsequently, there are plans to open a new factory in Hefei in the first half of next year and the earliest new factory in Beijing in the second half of next year, with another new factory in Hefei opening in the first half of the year after next.

Equipment industry insiders say that CXMT has communicated with multiple parties regarding the timing of building factories in various locations. If all plans are realized, CXMT could add at least 70,000 to 80,000 wafers of capacity per month each year from this year until 2028, with a long-term goal of exceeding 600,000 wafers per month. Samsung Electronics and SK Hynix's DRAM capacities are estimated at about 700,000 wafers and 600,000 wafers per month, respectively.