The TSMC board approved a capital budget of 29.4 billion USD, bringing the total for the year to 60.7 billion USD

On August 11, TSMC held a board meeting and approved a capital budget of approximately $29.443 billion to expand advanced process and advanced packaging capacity to meet the strong demand brought by AI and high-performance computing. In May of this year, the board had already approved $31.283 billion, bringing the total approved capital budget for the year to $60.726 billion (approximately NT$1.96 trillion). TSMC Chairman C.C. Wei stated at the July earnings call that in the coming years, 13 advanced wafer fabs and advanced packaging plants will continue to be built in Taiwan, covering Kaohsiung, Hsinchu Baoshan, and Tainan, with the total investment scale in Arizona, USA also increasing to $26.5 billion.

The board also approved the establishment of a joint venture with Sony Semiconductor Solutions Corporation, with TSMC's investment cap set at 282 billion yen. The joint venture will be located in Kumamoto Prefecture, Japan, aiming to mass-produce next-generation image sensors for smartphones by 2029. In addition, the board approved a cash dividend of NT$7 per share for the second quarter, with the ex-dividend date set for December 10. TSMC will provide eligible foreign shareholders with the option to receive cash dividends in US dollars.