Rising Sun Technology Holdings receives additional advanced packaging and testing orders from Google TPU and Intel

According to a report by the Economic Daily, ASE Technology Holding benefited from the increased capacity of Google TPU, significantly adding advanced packaging and testing orders. Intel is accelerating the promotion of its EMIB advanced packaging platform while simultaneously expanding its outsourcing orders to ASE Technology Holding, with the previously raised testing quotes showing benefits. Google continues to increase its AI capital expenditures to expand data centers, using TPU to support the Gemini large model, AI agents, and Google Cloud services. The market estimates that Google TPU will enter a large-scale production phase by 2028, with shipments expected to reach 12 to 15 million units. ASE Technology Holding has mastered 2.5D, 3D advanced packaging, and high-end testing technologies, and Google is also expanding its use of TSMC's advanced processes and CoWoS capacity.

Intel is racing to advance its EMIB packaging platform, with major cloud companies like Meta and Google successively adopting the EMIB and EMIB-T platforms. ASE Technology Holding, positioned as a pure testing and packaging foundry, can directly procure organic embedded silicon bridge substrates to undertake backend wafer-level assembly and high-end testing services. Wu Tianyu, the Chief Operating Officer of ASE Technology Holding, believes that Intel's EMIB and TSMC's CoWoS are not zero-sum competitors. As the testing time for AI chips lengthens, the costs of equipment, materials, and labor are rising, and high-end packaging and testing capacity is becoming increasingly tight. Major testing and packaging factories have gradually raised prices based on products, capacity, and customer conditions, with increases of about 5% to 10%.