AI chip company Groq plans to introduce 3D stacked DRAM in the next generation of chips

According to a report from ZDNet Korea on October 20, the AI chip company Groq, which has been effectively acquired by NVIDIA, is advancing the introduction of DRAM 3D stacked packaging in its next-generation chips to replace the fast but lower-capacity SRAM solution. Groq was founded in 2016 by former Google TPU designer Jonathan Ross, and it was reported that the company was acquired by NVIDIA in a roundabout manner last year.

The report states that Groq is evaluating a solution called 3DS, which vertically connects DRAM chips through silicon vias for high-capacity packaging. 3D packaging allows multiple bare chips to be stacked vertically and operate as a single chip, reducing area and improving power efficiency compared to planar solutions. Both 3DS and HBM use silicon vias, but HBM focuses on transmission speed, while 3DS maintains existing DRAM interfaces and focuses on capacity expansion. Anonymous industry insiders indicated that Groq plans to adopt 3D packaging in its next-generation chips, stacking DRAM instead of SRAM; another individual noted that market demand is shifting towards larger capacity chips, prompting Groq to choose DRAM, which has a capacity advantage.