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XLM $0.1802 +0.67%
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first_img Micron plans to expand HBM production capacity to approximately 100,000 wafers per month by the end of the year

According to Electronic News on September 3, Micron plans to double its high bandwidth memory (HBM) production capacity compared to last year, with a maximum addition of 60,000 wafers per month by the end of this year. Insiders say that Micron's HBM output was about 40,000 to 50,000 wafers per month last year, and it is expected to reach about 100,000 wafers per month by the end of the year, narrowing the gap with Samsung Electronics and SK Hynix.Micron is increasing procurement orders from multiple HBM equipment suppliers, with production bases mainly in Taiwan and Singapore, continuously introducing equipment. Currently, the output is mainly HBM3E 12-layer, with HBM4 12-layer accounting for about 20% to 30% at the beginning of this year, which may rise to as high as 50% by the end of the year. HBM4 12-layer will be used in NVIDIA's latest AI accelerator, Vera Rubin, and Micron has started mass production of this product since the second quarter of this year.Micron CEO Mehrotra stated in the Q3 earnings call for fiscal year 2026 in June this year that the ramp-up speed of HBM4 12-layer mass production is about twice that of HBM3E 12-layer, and cumulative revenue from HBM4 shipments has exceeded $1 billion. The industry believes that Samsung and SK Hynix each have HBM production capacities of about 150,000 to 200,000 wafers per month. Counterpoint data shows that in Q2 of this year, the global HBM market shares were SK Hynix 50%, Samsung 32%, and Micron 18%. Micron is also preparing related investments in Hiroshima, Japan.

Garrett Jin: Bitcoin holds key support, maintaining a constructive outlook before the end of the year under macro pressures

BTC OG insider whale agent Garrett Jin released a market outlook indicating that the macro environment has clearly tightened this week, with Brent crude oil approaching $95, and the yield on the U.S. 10-year Treasury bond breaking through 4.8%. The market's expectation of a rate hike by the Federal Reserve in September has risen to about 70%. Bitcoin has slightly retraced under this pressure but successfully held the key support level of $76,600, then rebounded to the high range of $77,000.On-chain cost basis data shows that a significant amount of new supply has formed in the $75,000 to $80,000 range, providing strong support for the market; the $80,000 to $82,500 range is currently the largest concentration of resistance. A daily close above $82,500 and a successful retest confirmation will be a key signal for supply clearance. In terms of ETF liquidity, there was a net inflow of about $3.5 billion into U.S. spot ETFs in August, but a two-way flow has appeared at the start of September, with a net outflow of about $237 million on Tuesday, and retail activity has also cooled down.Regarding downside risks, if the daily close falls below $76,600, and ETF flows, Coinbase premiums, and 7-day net realized profits all weaken simultaneously, it will be seen as a clear warning signal. This Friday's non-farm payroll data will be the next important macro testing point; if the data is hot, it will strengthen rate hike expectations, and the $76,600 support may come under pressure again.

first_img The U.S. Department of Justice and CrowdStrike teamed up to dismantle the Sality botnet, which had been operating for over 20 years

According to Decrypt, CrowdStrike and the U.S. Department of Justice announced on Tuesday that they have dismantled the Sality peer-to-peer botnet, which has been active since 2003.This botnet primarily hijacked cryptocurrency payments through the EggJagger malware over the past eight years, which monitored the cryptocurrency wallet addresses in victims' clipboards and replaced them with the operator's own address, causing victims to send funds to strangers.CrowdStrike estimates that the operator has stolen at least 12.1 million rubles (approximately $150,000) solely through the EggJagger payload. Most of the stolen cryptocurrency has not been spent, and CrowdStrike assesses that these unspent assets were worth about 147 million rubles (nominally around $1.35 million) at their peak in January 2025. The reason Sality has survived to this day is that it does not have a central server that can be seized; infected machines communicate directly with each other.This multinational operation involved the United States, Bulgaria, Hungary, and Romania. The U.S. Department of Justice, FBI, and Defense Criminal Investigative Service seized Sality-related domains within the United States, and police from multiple European countries also seized other domains.CrowdStrike isolated more than 15,000 infected machines to its controlled honeypot by exploiting its architectural vulnerabilities. The operator has been tracked as SALTY SPIDER, which launched a denial-of-service attack against the Russian cryptocurrency exchange AvanChange in September 2023.

first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.
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