emib

On August 24, SK Hynix is introducing advanced packaging technologies, including Intel's EMIB, for its next-generation HBM solutions and plans to eventually enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix's Vice President of Packaging Engineering, Jaesik Lee, delivered a presentation titled "Advanced Packaging for High Bandwidth Memory," explaining how the company will leverage advanced packaging technologies to accelerate its HBM product roadmap.Currently, SK Hynix is exploring methods such as hybrid bonding to break through the limitations of 16-layer stacking. In the future, SK Hynix also plans to address power consumption challenges by increasing the number of TSVs, improving IO speeds of logic process integration, and optimizing power distribution networks. As of the time of publication, SK Hynix's stock rose by 1.71%.

According to Taiwanese media reports, Intel's next-generation advanced packaging technology EMIB-T is facing severe yield challenges. ABF substrate supplier Unimicron stated during its earnings call on July 29 that the technology is "not yet mature," and the yield target for three EMIB-T substrate suppliers (Unimicron, Ibiden, and Shinkawa) during the initial mass production phase at the end of 2027 is only 50%.EMIB-T is Intel's advanced packaging solution that competes with TSMC's CoWoS-L, differing in that it embeds the silicon bridge directly into the substrate rather than using a silicon interposer, making substrate suppliers a key factor in determining success or failure. Google's ninth-generation TPU has confirmed that it will adopt EMIB-T packaging when it goes into mass production in 2028, with MediaTek responsible for chip co-design. If the chip successfully goes into mass production, its shipment volume is expected to challenge NVIDIA. Unimicron stated that the customer (Intel) has provided a profit guarantee mechanism, ensuring that suppliers can remain profitable even if yields are poor, and that profit margins will exceed the company's average level after achieving the 50% yield target. Currently, there is still considerable uncertainty about whether EMIB-T can achieve its mass production target by the end of 2027.