electron

According to Bloomberg, informed sources say that Samsung Electronics is in talks to acquire the U.S.-listed data center cooling system manufacturer Modine Manufacturing. The two parties are discussing a potential deal that could be reached in the coming weeks. No final decision has been made yet, and negotiations could still break down or other bidders may emerge.Modine was founded in 1916 and primarily develops thermal management systems. As of Thursday, the company's market value was approximately $5.6 billion. Following the announcement of the acquisition talks, Modine's stock price rose about 29% in after-hours trading.

According to a report by the Korean News Agency, Shin Eun-seop, the director of the Electronic Financial Inspection Bureau of the Financial Supervisory Service of Korea, stated at a discussion held at the Financial Investment Education Institute in Yeouido, Seoul, that if stablecoins are used as a means of electronic payment, it is inevitable that the Electronic Financial Transactions Act will apply from the perspective of fairness with existing electronic payment methods, user protection, and payment settlement stability.

Samsung Electronics plans to complete the development of advanced packaging technology 3D Cube-H by early 2027 and finish the first design kit, followed by evaluations with potential customers. This technology achieves vertical stacking of chips based on hybrid bonding, primarily targeting high-performance AI semiconductors, which can be used to stack logic chips such as GPUs or integrate logic chips on memory chips like HBM.Samsung Electronics has previously developed 3D Cube-T using thermocompression bonding technology and is currently advancing 3D Cube-H with a terminal pitch of about 6 micrometers, while the minimum terminal pitch for thermocompression bonded chips is about 25 micrometers. Hybrid bonding connects copper materials directly between chips, allowing for reduced terminal pitch, increased connection density, and lower energy consumption per bit, with thermal characteristics that differ from thermocompression bonding solutions.

According to a report by the Korean News Agency, the Financial Supervisory Service's electronic disclosure system shows that Lee Jae-young, the representative director and head of the DX division of Samsung Electronics, purchased 3,000 shares of the company's common stock on November 6, at an average transaction price of 210,000 Korean won per share, totaling approximately 630 million Korean won. After the increase, his shareholding rose from 124,280 shares to 127,280 shares.The report states that this move comes at a time when Samsung Electronics' stock price has recently fallen significantly following the U.S. midterm elections, interpreted as a demonstration of a commitment to responsible management. Lee Jae-young previously purchased about 3,045 shares at 230,000 Korean won per share at the end of July. On the same day, Samsung Electronics' stock fell by 6.35%, closing at 188,700 Korean won.

According to Gate market data, the South Korean KOSPI index opened down 1.62%, Samsung Electronics fell 2%, and SK Hynix slightly declined.

Tokyo Electron's annual performance outlook exceeds market expectations, with an estimated operating profit of 1.17 trillion yen (approximately 7.4 billion USD) for the fiscal year ending in March next year, a year-on-year increase of 64%.Operating profit for the third quarter rose to 295.4 billion yen, surpassing the market expectation of 256.1 billion yen.

According to market data from RootData, the South Korean KOSPI index fell sharply by 3.00% during the day, currently reported at 5831.67 points. Samsung Electronics dropped nearly 6%, and SK Hynix fell by 0.4%.

Samsung Electronics stated that the investment plan for the chip division will be used to build new fabs and other infrastructure to meet strong demand for AI and HPC, while ensuring readiness in the medium to long term.

The shortage caused by the AI boom has extended from GPUs and memory to circuit boards. When planning their supply chains for 2027, HP and Dell found that even previously inconspicuous printed circuit boards could face shortages. In September this year, Amazon invested approximately 1.59 billion New Taiwan Dollars in Taiwanese circuit board manufacturer Gold Circuit Electronics, transitioning from customer to shareholder.AI servers require circuit boards with more layers and lower signal loss, and chip packaging substrates are becoming larger, driving up the demand for key materials such as specialty fiberglass cloth and copper-clad laminates. Suppliers prioritize fulfilling more profitable AI orders, squeezing ordinary servers, with some ordinary server circuit board delivery times approaching one year.It is difficult for the production capacity of key materials to keep up with demand in the short term. TrendForce estimates that Japan's Nitto Denko controls about 90% of the global T-glass specialty fiberglass cloth market, with new production capacity not expected to come online until mid-2027 at the earliest. The chairman of Taiwanese substrate manufacturer Unimicron Technology warned on October 20 that some key materials could be short by about 20% by 2027, with delivery times for some chip substrate production equipment extending to as long as 30 months.

South Korean chip companies Samsung Electronics and SK Hynix will release their third-quarter financial reports next week, with strong demand for artificial intelligence storage chips expected to drive substantial profits for both companies.SK Hynix is scheduled to announce its financial report on Wednesday, while Samsung Electronics will follow closely on Thursday.

According to the United States Patent and Trademark Office (USPTO), a patent from Samsung Electronics titled "Electronic Devices and Their Operating Methods Providing Blockchain Service" was officially granted on October 20.This technology allows electronic devices to identify nearby devices that support blockchain services through wireless signals, establish peer-to-peer connections, and select the device with the most recent data to complete blockchain synchronization by comparing the latest block heights stored on each device. This patent can reduce network traffic and energy consumption when devices synchronize block data.

The Digital Currency Renminbi Operation Management Center interprets the recently released core results of the central bank's digital renminbi system DCEPS and the digital renminbi smart contract ecological service framework e-CNY SMART Contract. DCEPS is a comprehensive payment and settlement platform that integrates issuance management, retail, wholesale, blockchain payment, and smart contract services, providing a technical foundation to support digital currency.e-CNY SMART Contract is designed to meet the needs of digital economic development, constructing a smart contract service system that involves multiple participants and open collaboration, which has already been implemented in scenarios such as prepaid fund management, supply chain finance, fiscal subsidies, consumer red envelopes, and wage distribution for migrant workers. The digital renminbi has been upgraded from cash-type 1.0 to deposit currency-type 2.0 as of January 1, 2026, with DCEPS and the digital currency cross-border settlement comprehensive service platform being built and operated by the Digital Currency Renminbi Operation Management Center and the International Operation Center, respectively.

According to Gate market data, the South Korean KOSPI index closed down 214.93 points on October 20 (Tuesday), a decrease of 3.73%, reporting at 5553.08 points. Samsung Electronics fell by 2.98%, and SK Hynix fell by 4.22%.

Bitget has launched 8 popular Taiwanese stock perpetual contracts including TWTSM (Taiwan Semiconductor Manufacturing Company), TWDELTA (Delta Electronics), TWASX (ASE Technology Holding), and TWUMC (United Microelectronics Corporation). The above contracts are settled in USDT, support up to 20 times leverage, and are available for trading 24/7. As of now, Bitget supports a total of 364 stock perpetual contract underlying assets.

According to a report by ZDNet Korea on October 15, Samsung Electronics has lowered its production plan for mid-range and low-end smartphones in the fourth quarter. The reasons include rising prices of memory chips and disruptions in the supply of glass fiber used in PCB raw materials CCL. Japan's Nitto Denko is shifting more production capacity towards T-glass for AI semiconductors, reducing the output of E-glass for smartphone PCBs, leading to supply shortages and price increases. E-glass is used in semi-cured sheets for smartphone motherboards HDI and RFPCB.The report states that after the rise in storage prices increased manufacturing costs, Samsung reduced orders for related components. Models like the Galaxy A have lower profitability, making it difficult to significantly increase production. This year, the prices of basic mid-range models have risen by more than 100,000 Korean Won compared to the previous generation. The outlook for component orders communicated to partners for the fourth quarter corresponds to an annual smartphone shipment volume of just over 230 million units, which is below the component industry's expectation of 240 million units and represents a decrease of 20% to 30% compared to before the Mid-Autumn Festival holiday. Plans for the mobile business next year have not been shared with partners as in previous years.The monthly production outlook for the fourth quarter in mid-September was 14.3 million units in October, 9.5 million units in November, and 7.6 million units in December, totaling 31.4 million units. This was adjusted at the beginning of this month to 9.9 million units in October, 7.6 million units in November, and 6.7 million units in December, totaling 24.2 million units, a reduction of 23%. While the production of mid-range and low-end models has been lowered, the shipment plans for flagship models like the Galaxy S27 at the beginning of next year remain at a high level, and the shipment volume for foldable phones is also planned to increase. The MX and Network divisions reported a loss of 735 billion Korean Won in the second quarter, with the securities industry projecting an annual loss of 400 billion Korean Won.

According to Gate market data, Samsung Electronics fell 6% in pre-market trading on the Korean stock exchange, SK Hynix dropped 7%, and overnight U.S. stocks in the storage sector generally declined.

According to The Defiant, the European Banking Authority has recognized the US dollar stablecoin USDC as the EU's first "significant" electronic money token. Under the arrangement, the financial regulatory responsibilities for USDC will be transferred to the European Banking Authority on November 12.Meanwhile, the French Prudential Supervision and Resolution Authority will continue to be responsible for the governance and other corporate affairs of USDC.

According to CoinDesk, the consortium Qivalis, supported by 37 major European banks, announced that the Dutch Central Bank (DNB) has granted it an Electronic Money Institution (EMI) license, bringing it closer to issuing Euro-denominated electronic money tokens (EMT). The Amsterdam-based company still needs to meet the remaining requirements of the EU's Markets in Crypto-Assets Regulation (MiCA), including publishing a white paper, in order to issue the token in the coming months.This license enables Qivalis to provide a blockchain-based method for transferring Euros for banks and payment institutions. Qivalis plans to distribute its tokens through banks, cryptocurrency exchanges, and payment service providers, rather than directly to consumers. Since its establishment in September 2025, the consortium has expanded to 37 European banks, including BBVA, BNP Paribas, ING, and DZ Bank, and has chosen Fireblocks to provide digital asset infrastructure.According to MiCA regulations, EMTs are classified as stablecoins, but not all stablecoins are EMTs. EMTs are pegged to a single fiat currency and must be issued by authorized credit institutions or electronic money institutions, with holders having legal claims to them and the right to redeem them at face value at any time, and EMTs cannot pay interest.Qivalis CEO Jan-Oliver Sell stated that the currency in Europe should be carried on-chain by European rules, and Europe should have Euro-denominated on-chain settlement assets issued under European law and subject to European regulatory standards.

According to a report by ZDNet Korea on October 12, Samsung Electronics is expanding the application range of the next-generation NAND flash memory zNAND and plans to subdivide the products into three types: zNAND-O, zNAND-T, and zNAND-I, in addition to the publicly announced zNAND-O. The report states that Samsung Electronics has not officially announced the latter two products, but the industry has learned that related plans have entered the early development stage to address the increasing demand for customized storage in AI infrastructure.zNAND-O is aimed at edge AI. Unlike traditional wire bonding, this solution vertically stacks NAND in 4 or 8 layers through silicon vias, shortening the data transmission path and enhancing speed and energy efficiency. Samsung Electronics first publicly showcased the zNAND-O model at a memory-related event in the United States in August this year.zNAND-T focuses on throughput and is aimed at high-capacity, high-performance AI data centers, also expanding bandwidth through vertical stacking and silicon vias, and is referred to by the industry as high-bandwidth flash memory. zNAND-I focuses on increasing input/output operations per second, used for frequent processing of small-capacity temporary data such as key-value caches in AI inference. The report also mentions that SK Hynix is developing AI NAND product series such as AIN P, AIN D, and AIN B.