Tongxin Intelligence has completed hundreds of millions in financing, with plans to begin prototype validation for its first AGI chip in December

According to Jiemian News, Tongxin Intelligence has completed hundreds of millions in seed and angel round financing, with investors including Tsinghua Alumni Seed Fund, Beijing General Artificial Intelligence Research Institute, Songlin Technology, Pingzhi Information, Anwu Intelligence, and Yuzizhangquan.

The funds from this round will mainly be used for core architecture design and research and development before chip tape-out. Tongxin Intelligence was founded in April 2026 by artificial intelligence scientist, president of Beijing General Artificial Intelligence Research Institute, and chair professor at Peking University and Tsinghua University, Zhu Songchun. Its first product is positioned to support AGI algorithm inference chips, aimed at applications such as large models, world models, and general intelligent agents, with plans to start FPGA prototype verification in early December this year.