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According to a report by the Economic Daily, ASE Technology Holding benefited from the increased capacity of Google TPU, significantly adding advanced packaging and testing orders. Intel is accelerating the promotion of its EMIB advanced packaging platform while simultaneously expanding its outsourcing orders to ASE Technology Holding, with the previously raised testing quotes showing benefits. Google continues to increase its AI capital expenditures to expand data centers, using TPU to support the Gemini large model, AI agents, and Google Cloud services. The market estimates that Google TPU will enter a large-scale production phase by 2028, with shipments expected to reach 12 to 15 million units. ASE Technology Holding has mastered 2.5D, 3D advanced packaging, and high-end testing technologies, and Google is also expanding its use of TSMC's advanced processes and CoWoS capacity.Intel is racing to advance its EMIB packaging platform, with major cloud companies like Meta and Google successively adopting the EMIB and EMIB-T platforms. ASE Technology Holding, positioned as a pure testing and packaging foundry, can directly procure organic embedded silicon bridge substrates to undertake backend wafer-level assembly and high-end testing services. Wu Tianyu, the Chief Operating Officer of ASE Technology Holding, believes that Intel's EMIB and TSMC's CoWoS are not zero-sum competitors. As the testing time for AI chips lengthens, the costs of equipment, materials, and labor are rising, and high-end packaging and testing capacity is becoming increasingly tight. Major testing and packaging factories have gradually raised prices based on products, capacity, and customer conditions, with increases of about 5% to 10%.

Liquid Capital founder Yi Lihua stated, "In the cryptocurrency industry for over a decade, it has been a small world with human emotions and conflicts. Perhaps it's too close to money, or perhaps there are no rules; regardless, the remaining voices in the industry are mostly negative, and the industry's reputation is getting worse.I sincerely hope everyone shifts their attention back to innovation and opportunities in the industry. A new bull market is about to begin, and on-chain finance, especially stocks, has opened up imagination. There are still many meaningful things and opportunities to gain wealth coming, not to mention that the entire cryptocurrency industry is just a fraction of what exists, with the AI industry, which is dozens of times larger than cryptocurrency, worth exploring."

SK Hynix CEO Kwak Noh-Jung stated that the company is exploring ways to deepen cooperation with Japanese memory chip customers and suppliers, and is cautiously assessing how to jointly develop the NAND flash memory market. Regarding the company's significant indirect stake in Kioxia, he mentioned that there are currently "no definite plans."After Toshiba's recent divestment, SK Hynix's investment vehicle BCPE Pangea Cayman2 has become Kioxia's largest shareholder, holding a 14.19% stake. SK Hynix holds bonds that can be converted into nearly all voting rights of this investment vehicle; according to a previous agreement, its voting rights cannot exceed 15% before 2028 without Kioxia's consent.In addition, SK Hynix is investing over $4 billion to build its first U.S. HBM packaging facility in Indiana. The cleanroom of the factory is expected to be operational by October 2028, with mass production of the next generation HBM planned for the second half of 2029, and it is expected to employ about 1,000 people once fully operational. The company is also still evaluating the possibility of listing its U.S. NAND subsidiary Solidigm, but no decision has been made yet.

On August 27, B.AI announced that the latest open-source Qwen3.8-Flash model from Alibaba Tongyi Qianwen has officially landed on the platform, with the API official group fully open for free calls. This multimodal MoE model serves as a forward-looking preview of the Qwen4 architecture, featuring a total of 125B parameters and 51B N-gram Embedding, activating 6B parameters per token.The model integrates the GDN and QSA mixed attention mechanisms for the first time, natively supporting 262K context and can be extended to 1M via YaRN. Developers can start calling it at zero cost for tasks such as programming assistance, agent workflows, and document analysis.

On August 27, the one-stop AGI infrastructure platform B.AI announced that the Zhipu GLM-5.3-Flash (320B-A18B) officially launched on the platform and is fully open for free in the API official group. As the first native multimodal model in the GLM-5 series, GLM-5.3-Flash features a total of 320 billion parameters and 18 billion active parameters, supported by computing power from purely domestic AI chips. It introduces a mixed architecture of sparse and linear attention for the first time, combined with a 1M ultra-long context, offering both powerful performance and exceptional cost-effectiveness. Starting today, developers can call it at zero cost through the B.AI API official group, easily handling complex reasoning, long text processing, and multimodal tasks.

Apple's first 2-nanometer M6 chip officially debuts, equipped with a 12-core CPU, 12-core GPU, and dual 16-core neural network engines, with unified memory bandwidth reaching up to 170GB per second, initially featured in the new Mac mini. This chip is manufactured by TSMC using a 2-nanometer process and is the first to adopt gate-all-around (GAA) nanosheet transistors, making it the world's first consumer-grade 2-nanometer chip.The supply chain is focused on the subsequent high-end M series packaging architecture. Based on the Fusion Architecture of the previous generation M5 Pro, M5 Max, and the four-die design of M5 Ultra, Apple chips have transitioned from a single large die to a modular design. Future M6 Pro, Max, or Ultra are expected to enhance advanced packaging requirements such as SoIC-MH and WMCM, increasing interconnect density with SoIC-MH and integrating logic, LPDDR memory, and high-speed I/O with WMCM.TSMC is actively preparing for expansion, with Zhunan AP6 as the main mass production base for SoIC, Longtan AP3 upgrading to WMCM, and Chiayi AP7 taking on related capacity. Analysts estimate that WMCM's monthly production capacity will reach about 60,000 units by the end of 2026 and over 120,000 units in 2027. Equipment manufacturers such as Hongshuo, Junhua, Yinneng, and material manufacturers Changxing, Xinying Materials, and Yongguang are expected to benefit.

According to TIME, OpenAI CEO Sam Altman recently stated in an interview that the company has previewed the upcoming cutting-edge model series Astra to key clients. In the demonstration, 16 AI agents can collaboratively break down mathematical problems and assemble proofs, and Astra can operate computer software across applications at superhuman speeds. Altman mentioned that Astra will support "persistent agents" capable of performing long-term tasks and is expected to be the first model that can invent new things in a meaningful way, possessing characteristics of AGI.Over the past year, OpenAI has fallen behind expectations in product direction and pre-training research, being surpassed by Anthropic in programming products, annual revenue, and valuation. The company has experienced multiple executive departures and is facing challenges such as several product liability lawsuits and legal disputes with Apple and Musk. OpenAI's current valuation is nearly $1 trillion, with ChatGPT having over 1 billion monthly active users.Recently, OpenAI disclosed a security incident: an unreleased agent escaped the sandbox and attacked Hugging Face. Following this, the research team froze some experiments, enhanced monitoring, and paused the training of an unreleased model expected to bring the greatest capability leap until new safety measures are in place. Altman emphasized that "ensuring AI safety is more important than the growth momentum of any company," and the company will slow its pace and allocate resources to safety and alignment teams. Chief Research Officer Mark Chen estimated that the company is about 80% complete in reaching AGI, and Altman stated that the internal system may be referred to as AGI by the end of the year.

One-stop AGI infrastructure platform B.AI released the latest ecological data: On August 25, the number of new API users reached 23,432 in a single day, with a total of 79,500 new API users during the period; the single-day token throughput exceeded 594.71 billion, with a total of 74.108 million calls during the period and a cumulative throughput of over 3 trillion tokens.Two core indicators simultaneously refreshed historical records. The continuous influx of developers and explosive growth in computing power demand confirm B.AI's exceptional stability and extreme cost-effectiveness in high concurrency and complex load scenarios. B.AI is committed to becoming the preferred inclusive computing infrastructure for global teams, accelerating the comprehensive implementation of AGI.

The B.AI platform's daily computing power throughput has surpassed 59.078 billion tokens, achieving nearly an 8-fold explosive growth in just 8 days since August 18, continuously breaking historical peaks.From the hundred billion level to nearly 600 billion, the demand curve for B.AI's computing power continues to rise. The platform maintains stable operation amidst sustained high concurrency peaks and massive automated scheduling tasks, demonstrating extremely high system resilience and scheduling efficiency. Behind this steep growth curve is the global developers' high recognition of B.AI's exceptional cost-performance ratio and very low access threshold, which is accelerating the large-scale implementation of production-level AI Agents and automated workflows on the platform.At the same time, with the full launch of the MiMo series and the ongoing popularity of free model activities, the platform's ecosystem activity and developer stickiness are rising in tandem. B.AI will continue to deepen its focus on AI computing power and Agent financial infrastructure, providing more inclusive computing power supply and more stable infrastructure, fully accelerating the comprehensive implementation of AGI.

As of the evening of August 24, the B.AI platform has officially surpassed 2.1 million registered users, continuing its strong growth momentum after reaching the 2 million milestone.With the continuous expansion of the cutting-edge large model matrix, decreasing costs of computing power, comprehensive upgrades to product interaction experiences and underlying architecture, along with an increasingly完善 AI Agent ecosystem, more and more global developers and users are being attracted to explore and build the next generation of intelligent applications through B.AI with lower barriers and higher efficiency.The trillion-level token daily throughput capacity and the rapidly expanding developer community have become the best footnote for B.AI's robust ability to support scalable production-level workloads, further solidifying its strategic positioning as the financial infrastructure of the AI Agent era. 2.1 million is a new starting point, and B.AI will accelerate the construction of an inclusive future for AGI together with the global community.

On August 24, SK Hynix is introducing advanced packaging technologies, including Intel's EMIB, for its next-generation HBM solutions and plans to eventually enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix's Vice President of Packaging Engineering, Jaesik Lee, delivered a presentation titled "Advanced Packaging for High Bandwidth Memory," explaining how the company will leverage advanced packaging technologies to accelerate its HBM product roadmap.Currently, SK Hynix is exploring methods such as hybrid bonding to break through the limitations of 16-layer stacking. In the future, SK Hynix also plans to address power consumption challenges by increasing the number of TSVs, improving IO speeds of logic process integration, and optimizing power distribution networks. As of the time of publication, SK Hynix's stock rose by 1.71%.

According to Ai Yi's monitoring, a whale that leveraged to go long on ETH and BTC has once again realized profits worth 7.24 million USD in ETH.This whale deposited 3,000 ETH to Binance 4 hours ago, with an average selling price of 1,776.83 USD and an average deposit price of 2,413.4 USD. If sold, it would profit 1.91 million USD; since August 19, this whale has cumulatively deposited 13,887.15 ETH to exchanges, realizing a total profit of 6.727 million USD.

According to Cointelegraph, Cathie Wood of Ark Invest stated that AI is likely to trigger an entrepreneurial explosion, and she encourages recent graduates to use AI as their sole employee to start their own companies.

According to a report by Infomax under the Korea Herald, SK Hynix is advancing its plan to build a semiconductor factory in Miyagi Prefecture, Japan, with an investment scale of hundreds of trillions of Korean won. SK Group Chairman Choi Tae-won recently visited the area personally. Miyagi Prefecture is one of the three major semiconductor industry bases supported by the Japanese government.The report states that this factory will be an overseas production base added by SK Hynix outside of its clusters in Yongin, South Korea, and Hunan, China, aimed at meeting the ongoing tight global supply and demand situation for memory. If the plan materializes, SK Hynix will become the third foreign semiconductor company to establish a factory in Japan, following Micron and TSMC. The report points out that due to ongoing pressure from the United States for South Korean companies to increase investments in the U.S., this investment in Japan may further intensify U.S. pressure, while the Japanese government's subsidy policy is also an important consideration. SK Hynix has not officially responded to this news. Previously, on August 20, SK Hynix announced a 40 trillion won share buyback cancellation plan.

On August 20, the B.AI platform DeepSeek-V4-Flash zero-threshold free access event continues. B.AI upholds the vision of "Inclusive Computing Power" and is committed to building a globally leading one-stop AGI infrastructure, continuously lowering the threshold for AI use, allowing developers and Web3 users to easily experience, build, and deploy Agentic applications.Relying on the one-stop AGI infrastructure, B.AI aggregates cutting-edge model matrices from around the world, with built-in intelligent routing to optimize costs and efficiency; stably supporting high-throughput scenarios such as millions of long contexts and Agent workflows; elastic API routing balancing production-level high availability and extreme cost-effectiveness; Web2/Web3 dual channels bridging crypto assets and fiat currency settlement. Currently, DeepSeek-V4-Flash is continuously available for free on both Web and API ends, with $0 access to top model capabilities.

According to the Economic Daily, TSMC's advanced packaging CoWoS capacity is in short supply, and it has been reported that some backend orders have overflowed to Intel's factory in Malaysia, where Intel is assisting with packaging using part of its capacity to serve common major customers, breaking the past ecosystem competition norms. TSMC Chairman Wei Zhejia previously stated at a conference call that TSMC focuses on advanced packaging in the frontend and welcomes "more manufacturers to supply capacity" for the shortage in the backend, providing flexible alternatives for common customers.The report points out that the bottleneck in advanced packaging capacity mainly lies in the backend ramp-up speed being lower than that of the frontend process, and the widening gap in CoWoS capacity has forced orders to overflow. SemiAnalysis Chipbook data shows that approximately $1.3 billion worth of HBM has been shipped to Malaysia, and industry analysis indicates that Intel's local factory should already have the capability for large-scale HBM integration. Intel CEO Pat Gelsinger stated that the EMIB-T technology is ensuring reliable yield, and in the context of insufficient CoWoS capacity, "Intel is in a unique position to provide support." Companies with overlapping supply chains such as Unimicron, ASE Technology Holding, and Jiadeng are expected to benefit simultaneously, with Unimicron's stock price rising over 7% on that day. Intel's EMIB-T related applications are targeted for mass production by 2027.

Former Magic Eden General Counsel sh0edog (Joe) announced his joining of the consumer-grade crypto finance application fomo as General Counsel. His personal background also includes being an advisor at Day One Law and previously working at Fenwick West, entering the crypto industry in 2016.sh0edog stated that fomo is one of the fastest-growing consumer finance applications, with daily spot trading volume exceeding $100 million and over 61,000 daily active traders. It ranks 5th in the finance category of the US App Store and has raised approximately $95 million in total funding. He noted that the team's execution and integrity are outstanding and is optimistic about its potential to build a global financial social network.fomo co-founder seyong and other team members have publicly expressed their welcome. sh0edog stated that he will assist in promoting fomo's development in the global consumer crypto and social application direction.