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cow

CoW Protocol is a decentralized trading protocol that focuses on optimizing trade execution and reducing trading costs. Its name comes from "Coincidence of Wants," which achieves slippage-free trading by matching users' trading needs. CoW Protocol reduces counterparty risk and miner extractable value (MEV) issues through a batch auction mechanism and on-chain settlement. This protocol is suitable for the decentralized finance (DeFi) ecosystem, providing a more efficient and fair trading environment.
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first_img TSMC 3/2 nanometers and CoWoS remain tight, AWS and MediaTek's capacity allocation has changed

As we enter the late third quarter of 2026, TSMC's 3nm and 2nm advanced process and CoWoS advanced packaging capacity continue to be in high demand. NVIDIA and Apple continue to dominate the resources for advanced processes and packaging; Amazon AWS's Annapurna has recently increased its AI self-developed chip production, securing more 3nm capacity. MediaTek, in addition to mobile chips, is also competing for 2/3nm process and CoWoS-S/L capacity with large orders related to Google TPU.There are reports that TSMC has recently readjusted its capacity allocation. After MediaTek secured a large order from Google TPU, the next-generation TPU v9 will simultaneously use TSMC's CoWoS-L and Intel's EMIB-T, which has slightly adjusted MediaTek's 3nm and 2nm capacity arrangements. Currently, TSMC's main customer for 3nm is NVIDIA, which is expected to surpass Apple to become the largest customer by 2025; the demand for 2nm is primarily from Apple and others. After AWS increased Annapurna's production, its 3nm and CoWoS configuration priority has improved.Starting in early 2026, TSMC will accelerate capacity expansion, with the 2nm monthly capacity of Hsinchu Baoshan Fab 20 and Kaohsiung Fab 22 reaching 50,000 wafers each by the end of October, totaling about 100,000 wafers; by the end of October, the monthly capacity for 3nm in Tainan Science Park is about 185,000 wafers. As of the end of September, the overall capacity utilization rate is about 96.2%, with 100% utilization for processes below 16/12nm down to 2nm. The shortage of CoWoS supply has driven advanced packaging orders to overflow, with the priority for orders going to ASE Group's Siliconware Precision Industries first, followed by Amkor, and Chipbond, among others. Chipbond's related testing and packaging capacity is fully loaded, with order visibility extending to 2028.

hot_img TSMC's CoWoS orders are overflowing, and it is reported that Intel's Malaysia factory will support backend packaging

According to the Economic Daily, TSMC's advanced packaging CoWoS capacity is in short supply, and it has been reported that some backend orders have overflowed to Intel's factory in Malaysia, where Intel is assisting with packaging using part of its capacity to serve common major customers, breaking the past ecosystem competition norms. TSMC Chairman Wei Zhejia previously stated at a conference call that TSMC focuses on advanced packaging in the frontend and welcomes "more manufacturers to supply capacity" for the shortage in the backend, providing flexible alternatives for common customers.The report points out that the bottleneck in advanced packaging capacity mainly lies in the backend ramp-up speed being lower than that of the frontend process, and the widening gap in CoWoS capacity has forced orders to overflow. SemiAnalysis Chipbook data shows that approximately $1.3 billion worth of HBM has been shipped to Malaysia, and industry analysis indicates that Intel's local factory should already have the capability for large-scale HBM integration. Intel CEO Pat Gelsinger stated that the EMIB-T technology is ensuring reliable yield, and in the context of insufficient CoWoS capacity, "Intel is in a unique position to provide support." Companies with overlapping supply chains such as Unimicron, ASE Technology Holding, and Jiadeng are expected to benefit simultaneously, with Unimicron's stock price rising over 7% on that day. Intel's EMIB-T related applications are targeted for mass production by 2027.

The Moscow Exchange plans to launch a digital custody platform, which will support cryptocurrency asset services as early as the end of this year

According to RBC, the Moscow Exchange (MOEX) in Russia is preparing to launch a digital custody platform for cryptocurrency trading (digital custodian). Sources say that the project is currently still in the development stage and is expected to go live as early as the end of 2026 to early 2027.It is reported that this digital custody platform will not be built on the Moscow Exchange itself or the National Settlement Depository (NSD) under it, but will operate as a completely new independent structure. As Russia's regulatory framework for digital currencies is expected to partially take effect from September 1, the market still lacks a clear plan for the custody and registration mechanisms of crypto assets. Various technical models are currently being discussed within the industry.One proposal is to establish multiple liquidity centers for crypto assets, where brokers can access the Moscow Exchange's digital custody platform or conduct related business through their own digital custody systems. Another proposal may involve trading platforms handling trade matching, while the storage and registration of crypto assets are completed by banks or digital custodians under brokers.Previously, several large banks in Russia, including Sberbank, VTB Bank, T-Bank, and Alfa-Bank, have expressed plans to launch digital custody services. With the Moscow Exchange entering this field, competition among traditional financial institutions is expected to intensify and may further enhance crypto asset services.
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