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ZEC $1,145.93 -6.29%
BTC $79,060.88 -1.06%
ETH $2,484.05 -0.70%
BNB $738.47 -1.49%
XRP $1.39 -1.70%
SOL $103.72 -1.69%
TRX $0.3343 -0.36%
DOGE $0.0901 -0.28%
ADA $0.2189 -1.08%
BCH $257.43 -0.20%
LINK $12.70 -2.09%
HYPE $85.03 -2.19%
AAVE $131.36 -2.21%
SUI $0.8159 +1.44%
XLM $0.1918 +3.22%
ZEC $1,145.93 -6.29%

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first_img Hacken Report: Half of USDT is controlled by only two signing keys

Blockchain security company Hacken released an assessment report indicating that approximately half of the circulating USDT (about $91.3 billion on the Tron network) is controlled by a 2-of-3 multi-signature contract, which lacks built-in delays, cancellation processes, or reliable revocation mechanisms. Attackers only need to compromise two signature keys to change contract ownership, mint tokens, freeze addresses, clear frozen balances, or set transfer fees without accessing any user wallets. Hacken also discovered that Tether reuses the same set of six signature keys across three chains: Ethereum, Avalanche, and Celo, posing a risk of cross-chain spread.Meanwhile, stablecoin rating agency Bluechip upgraded Tether's company rating from D to C, citing that KPMG's audit showed Tether's reserves exceeded liabilities by $6.8 billion as of December 31, 2025. This is the first time Bluechip has adopted the expanded SMIDGE methodology, which incorporates Hacken's technical risk analysis. However, Hacken only gave USDT a cybersecurity score of 3.3 out of 10 and pointed out that the USDT smart contract does not have automatic reserve proof checks or a token minting cap. Once signers authorize a transaction, the contract can mint an unlimited number of tokens without a bank reserve proof.Hacken stated that it has not yet completed an equivalent assessment of Circle's USDC, and Bluechip's previous B+ rating for USDC was based on an old methodology, which cannot be directly used for technical comparison.

first_img Samsung's 4-nanometer production capacity is more than half used for HBM4 substrate chips

Samsung Electronics' wafer foundry division has recently surpassed 50% in the allocation of production capacity for the sixth-generation high bandwidth memory HBM4 substrate chips in the 4-nanometer process. The industry states that this division will invest more than half of its 4-nanometer wafers into HBM4 substrate chip manufacturing in the second half of this year to expand supply to companies like NVIDIA, Broadcom, and AMD.Samsung initiated mass production and shipment of HBM4 in February this year and plans to increase supply starting from the third quarter, significantly increasing the related wafer input since mid-year. This chip is based on Samsung's wafer foundry 4-nanometer (SF4) process. As of last month, over 50% of its total 4-nanometer capacity has been allocated to HBM4 substrate chips. According to insiders, Samsung's 4-nanometer process is currently at full capacity, with HBM4 substrate chips accounting for about 50% to 60%, and this high proportion will be maintained in the second half of the year.Samsung's wafer foundry production lines at Pyeongtaek Plant 2 and Plant 3 are mass-producing processes ranging from 4 to 7 nanometers, with a monthly capacity of about 30,000 wafers for the 4-nanometer process. Based on this, the wafer input related to HBM4 substrate chips is estimated to be about 15,000 wafers per month. During the second quarter earnings call, Samsung stated that it expects HBM4 revenue to increase more than threefold quarter-over-quarter in the third quarter, with HBM4 revenue in the second half expected to exceed 60% of the company's overall HBM revenue.
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