mlc

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

According to the latest MLCC industry research by TrendForce, South Korean giant Samsung Electro-Mechanics has recently taken the lead in raising prices for OEM and ODM customers for the fourth quarter of 2026, indicating that the MLCC industry has officially entered an upward trend. TrendForce estimates that Samsung Electro-Mechanics will raise the prices of consumer-grade X5R products for OEM and ODM customers by an average of 25% to 30%, in order to suppress order willingness and free up capacity to expand high-end production lines.The high-end X6S products used in AI servers will see an average price increase of 10% to 20% depending on customer negotiations. Japanese manufacturers Murata, TDK, and Kyocera are currently taking a wait-and-see approach, maintaining stable prices, and whether they will follow up with price adjustments will be key to observing whether the upward trend can expand.

Driven by strong demand for AI, the MLCC market has seen a surge in price chasing and material grabbing. Industry sources indicate that some customers are willing to pay two to three times the price to secure supplies from major manufacturers like Yageo and Murata, creating a situation where the highest bidder wins. Yageo has admitted that AI-related customers are increasingly looking to lock in capacity in advance to reduce supply risks. Currently, major MLCC manufacturers are fully booked, with capacity nearing full load, and delivery times have extended to 12 to 16 months.In terms of capacity, Yageo expects the utilization rate for standard products this quarter to increase from about 80% in Q2 to over 90%, while special products will maintain a high level above 90%, overall trending towards full capacity. The company is also expanding production, with new capacity set to come online each quarter. Japanese manufacturers are also optimistic, with Murata significantly raising its annual profit forecast, and Taiyo Yuden stating that demand for AI servers has exceeded expectations. Industry insiders point out that large customers typically have a higher priority for capacity allocation, while small and medium-sized customers can only compete for limited supplies by offering higher prices. Yageo has noted that more and more customers wish to secure passive component supplies for the next six months to several years through long-term contracts to mitigate supply chain risks.

According to the latest survey by TrendForce, in June, the top three MLCC suppliers in Japan and South Korea (Murata, Samsung Electro-Mechanics, Taiyo Yuden) achieved a monthly shipment volume that reached a nearly five-year high, with 140 billion, 98 billion, and 40 billion units respectively, and the growth momentum continued into July. AI applications are the main driving force, with CSP manufacturers maintaining strong procurement demand for self-developed ASIC platforms such as Google TPU and AWS Trainium, driving continuous growth in demand for high-capacity, low-voltage, small-sized MLCCs.At the same time, Japanese and South Korean suppliers are accelerating the shift of production capacity from consumer-grade X5R to high-end X6S/X7R specifications, resulting in a severe squeeze on the production capacity of mid-to-high capacity (1µF-22µF) consumer-grade MLCCs, with mainstream inventory days generally falling below 30 days. The overflow effect of production capacity has led channels, agents, and second- and third-tier customers to urgently pull goods, significantly increasing order visibility for Taiwanese and mainland suppliers, leading to rising prices, with agents raising prices by an average of 20-25%, and spot market prices have soared to 2-3 times the original price. TrendForce pointed out that the consumer-grade MLCC market currently shows a structural mismatch of "weak end demand, strong channel pricing."