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first_img TSMC N2 mass production, Zhongsha Shengyang Semiconductor and other supply chains benefit

TSMC's 2-nanometer N2 mass production marks the transition of advanced semiconductor processes from FinFET to GAA generation. Industry analysts point out that with the simultaneous increase in process complexity, CMP track counts, wafer monitoring frequency, and material specifications, the demand for equipment, CMP consumables, reclaimed wafers, and advanced materials is rising, providing growth opportunities for suppliers like Zhongsha, Shengyang Semiconductor, Xinying Materials, and Songsheng. TSMC's N2 adopts nanosheet GAA technology, which can improve performance by 10% to 15% at the same power consumption compared to N3E, or reduce power consumption by 25% to 30% at the same speed, with chip density increasing by over 15%.In Zhongsha's largest customer Diamond Disk business, advanced processes account for 63%, with N3 and N2 each accounting for 22%, and 1.4 nanometers already shipped in small quantities; after N3 enters N2, the value of CMP content increases by 10% to 15%. Shengyang Semiconductor's monthly production capacity for reclaimed wafers is adjusted to 1.1 to 1.2 million pieces by the end of 2026, with a capital expenditure budget of 4.82 billion yuan for 2026, and it is estimated that the compound annual growth rate for reclaimed wafer expansion from 2025 to 2029 will reach 25% to 30%. Xinying Materials' core products Rinse, BARC, and EBR are expected to see shipments rise seasonally as N2 capacity ramps up, while Songsheng's semiconductor revenue accounted for 66% in the first half of the year, with a year-on-year increase of about 25%, and TSMC-related revenue increased by about 170% year-on-year.

first_img Market news: Intel's Razor Lake may adopt TSMC's N2X process

According to the Industrial and Commercial Times, competition in advanced process technology for PC processors is heating up. Market news indicates that Intel's next-generation Nova Lake desktop processor will prioritize the introduction of bLLC large last-level cache to reduce access latency to system memory, competing with AMD's 3D V-Cache technology; the laptop version may be delayed until the subsequent Razor Lake-HX generation is released. The supply chain reveals that Nova Lake, set to debut early next year, will utilize a combination of Intel's 18A and TSMC's N2P processes, while the subsequent Razor Lake may further adopt TSMC's high-performance 2-nanometer N2X process.N2X is a high-performance extension of TSMC's N2 platform, targeting high-frequency CPUs, AI, and HPC applications, with transistor technology shifting from FinFET to nanosheets. If mass production is achieved, Intel's collaboration with TSMC on advanced processes is expected to extend to a broader 2-nanometer family, helping to reduce risks associated with a single proprietary process and optimize the timing and capacity configuration for high-end CPU launches.In addition to TSMC benefiting directly, related supply chains are also expected to welcome business opportunities. Sungsan is one of the few manufacturers in Taiwan capable of mass-producing its own CMP polishing pads, with a 25% year-on-year increase in consolidated semiconductor revenue in the first half of the year, rising to 66% of total revenue. Demand for Hard Pads and advanced packaging is strong, with a new Soft Pad line expected to begin trial production in the third quarter and gradually ramp up production in the fourth quarter, with products already applied in CoWoS and SoIC. Zhongsha holds CMP diamond discs and recycled wafers, reporting revenue of 2.49 billion yuan in the second quarter, a year-on-year increase of 17.9%, with gross margin rising to 40.1%, and shipments of 2-nanometer and 1.6-nanometer related diamond discs rapidly increasing.
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