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first_img Breez: AI coding agency drives Bitcoin integration demand surge by approximately 14 times

Bitcoin software company Breez stated that since AI coding agents have become mainstream, the demand for its developer tools has surged significantly, with consulting requests increasing by approximately 14 times. Developers and the AI agents they deploy are seeking to integrate Bitcoin payments into their applications. Breez directly attributes this growth to Anthropic's Claude Code, which was launched as a research preview in February 2025 and officially opened three months later.Breez noted that before 2025, potential partners mainly fell into three categories: staunch Bitcoin enthusiasts, crypto developers, and fintech companies that view Bitcoin as an asset class. Since the launch of Claude Code, many developers with little to no Bitcoin experience have begun to inquire, with demand coming from fitness applications, messaging apps that want users to transfer money to each other, eSIM services for travelers, and a team developing a mushroom identification app. Breez stated that these developers often choose Bitcoin for its speed, as traditional payment processing involves bank accounts and cross-border transfers, which can take weeks or even months, while its SDK can be operational in just a few minutes.Breez mentioned that an increasing number of inquiries are coming from software rather than humans, as coding agents often represent the companies deploying them in making requests. The company believes that agents prefer Bitcoin because it is permissionless; agents can build applications and set up payments for global users without needing to open bank accounts, go through approvals, or sign documents. Breez stated that its latest SDK, built on the Bitcoin scaling protocol Spark, has successfully handled the increased traffic.

first_img Coinbase will restart Coinbase Pro by the end of the year and complete the integration with Deribit

Cryptocurrency exchange Coinbase announced that it will relaunch the Coinbase Pro platform by the end of this year and has completed the integration with Deribit, thereby forming Coinbase Global Exchange. Coinbase stated at the Token2049 event in Singapore that its U.S. regulated futures commission merchant, Coinbase Financial Markets, will soon connect eligible U.S. customers to global crypto derivatives liquidity, marking the first time in market history that the U.S. is linked to the international derivatives market as a single liquidity pool.Coinbase indicated that the guidance released by the U.S. Commodity Futures Trading Commission in May allows Coinbase Financial Markets to connect U.S. customers with the global crypto derivatives market, enabling U.S. institutional clients to access options and perpetual contracts that previously required offshore entities and multiple counterparties to use in a regulated manner. Qualified traders outside the U.S. will gain access to options trading in the coming weeks, while U.S. retail traders are expected to open later this year. U.S. institutional clients can trade Deribit options and perpetual contracts through Coinbase Prime, with account openings currently available.Coinbase acquired Deribit, one of the largest global crypto options exchanges, for approximately $2.9 billion in August 2025. As of September 30, Deribit had over $30 billion in open interest for Bitcoin options, with trading volume exceeding $1 trillion last year.

Sun Yuchen appeared in a video at HTX DAO "Night of the Future": AI and digital finance integration, promoting the free flow of value in the digital world

On the evening of October 6, HTX DAO's "Night of the Future" was held in Singapore. HTX DAO core supporter Sun Yuchen stated via video that the cryptocurrency industry is deepening its connection with traditional finance, promoting the continuous digitization of global financial infrastructure; AI is changing the way wealth is created, while Crypto and digital finance are altering the ways wealth is held and flows.Sun Yuchen pointed out that stablecoins are expected to play a more important role in global payments and settlements, and the on-chain applications of traditional assets such as bonds, funds, and gold will continue to be explored. After AI Agents enter economic activities, there will be further demand for identity, accounts, and independent trading capabilities. He emphasized that the long-term value of technology lies in its transformation into real productivity, and "the free flow of value in the digital world" is the trend he is most concerned about for the next decade, hoping that blockchain will enhance the accessibility, convenience, and efficiency of financial services.This event further strengthened the communication between HTX DAO and global communities and industry builders. HTX Ventures will appear at TOKEN2049 from October 7 to 8, with a booth located at PB5-47&48. From October 6 to 8, HTX DAO will also host several invitation-only events such as reunions and VIP private dinners.

Bonk Guy: The Fomo project will complete integration on Arc within a few days

Bonk Guy (Unipcs) posted that Fomo is expected to complete integration within a few days after the launch of the Arc chain, which changes its short-term judgment on Arc. He stated that builders related to Arc have recently contacted early on-chain traders multiple times, indicating their desire to generate early traffic for the new chain through Meme coin activities.Bonk Guy believes that the main opportunities on-chain this cycle are still concentrated in Robinhood, BNB, and Solana, and does not think Arc will become the next mainstream chain. However, he pointed out that Fomo has not yet integrated Hyperliquid, Tron, or TON, all of which have seen Meme assets with market capitalizations exceeding 100 million dollars. Therefore, if Arc connects with Fomo early after its launch, it could bring short-term trading opportunities. He revealed that he has purchased the native token LONG of the main launch platform Long, as well as the top three Meme coins on that platform.His core judgments include: Fomo will integrate Arc, Arc is actively attracting early on-chain traders, and Arc may learn from Robinhood's path of launching ecological growth through Meme activities. Bonk Guy also emphasized that the layout related to Arc is a short-term high-risk experiment and reminded to currently avoid using trading bots like Basedbot and GMGN to prevent significant slippage due to routing to incorrect liquidity pools.

first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.
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