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first_img Scroll plans to transform into an AI dedicated network, SCR will migrate to the Ethereum mainnet

Scroll Governance Forum posted that the team will recently apply AI extensively in operations and product development. Previously, core chain operations required over 20 engineers, but now it is completed by fewer dedicated engineers in conjunction with AI agents, while maintaining existing usability and security standards. The team believes that blockchain can provide a trusted coordination layer to define and execute rules, and ZK can help agents interact with credentials, private data, and computations without exposing underlying information.The team is building an interconnected product stack: Compass is an iOS application that can access the large models and functions provided by the Compass API, and includes VPN and eSIM; Compass API is the AI routing infrastructure, connecting over 30 large models; CENO provides a trust layer through ZK, protecting credentials, agent context, and privacy computations; USX is used for payments and settlements; SCR continues to coordinate governance; the Scroll network serves as a trust and coordination layer. CENO has reached out to over 30 potential clients, of which 12 are participating in proof of concept testing.The team plans to gradually transform Scroll from a general public chain into a dedicated network centered around Compass and the AI product stack, with an overall transition expected to take about nine months. According to the current plan, SCR will migrate to the Ethereum mainnet to maintain accessibility and liquidity, with supply and token economics remaining unchanged, and will continue to serve as a governance token. This post is only a progress update, not an official proposal or vote, and further proposals regarding the network transformation and matters requiring DAO approval will be made separately.
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first_img TSMC will start mass production using ASML's high NA EUV lithography machines in 2030

On September 8, TSMC announced that starting in 2030, it will adopt a new "high NA" extreme ultraviolet (EUV) lithography machine manufactured by ASML from the Netherlands for mass production. Both parties also stated that they will carry out industry-wide improvements on the high NA machines. ASML monopolizes the supply of EUV lithography machines used to form nanoscale ultra-fine circuits and will begin shipping high NA machines capable of drawing finer circuits starting in December 2023. Intel has already introduced high NA machines, while TSMC previously delayed mass production due to high costs and other reasons.TSMC and ASML will launch an industry-wide project to enlarge the photomask, which serves as the original circuit pattern, from the current 6-inch (approximately 15 centimeters) square to a 12-inch square, and develop high NA machines and related components corresponding to the large masks. A large mask pilot production line is planned to be established before 2031, and the high NA machines corresponding to the large masks are expected to reach a state suitable for advanced semiconductor production before 2033. Major semiconductor manufacturers and mask companies have expressed interest in participating.High NA machines can draw finer circuits, but the area that can be drawn in a single exposure is reduced to half that of traditional models, requiring multiple exposures for large chip circuits, which complicates the process and increases costs. Enlarging the photomask can expand the exposure area and reduce costs. TSMC Chairman and CEO C. C. Wei stated that the company will gather expertise from the entire industry to continuously promote technological innovation that makes advanced technology widely usable and convey its benefits.
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