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SlowMist: FomoPeek versions 1.1–1.2 contain malicious code, which may lead to the leakage of private keys and mnemonic phrases

SlowMist released a security warning stating that it has recently received multiple reports of FomoPeek users' assets being stolen. After a joint investigation with the OKX security team, it was found that some affected users had previously installed or used FomoPeek versions 1.1 to 1.2, which contained malicious code. SlowMist stated that there are modules in FomoPeek unrelated to normal business, one of which includes a kernel exploit framework targeting the iOS system, supporting eight different attack methods that can automatically select the exploitation method based on device model and iOS version. Affected systems include iOS 12 to 18.7 and iOS 26 to 26.1. If the exploitation is successful, the application may break through the iOS sandbox and access and decrypt Keychain data, leading to the leakage of private keys, mnemonic phrases, login credentials, and other sensitive files. In addition, FomoPeek also connects to hidden servers unrelated to its public services and can receive remote commands. SlowMist indicated that its analysis of captured plaintext traffic shows that the related attack functions are currently enabled and will run automatically on a regular basis. SlowMist recommends that users who have installed or used FomoPeek versions 1.1 to 1.2 immediately check for any anomalies in their assets, generate new private keys and mnemonic phrases on trusted devices that have never installed the application, and transfer assets to new accounts as soon as possible, while also upgrading to the latest iOS version and not continuing to use or reinstall FomoPeek.

first_img Analyst: PCB prices are expected to rise again in the third quarter, optimistic about Taiguang Electric and Nandian's future market

According to the Economic Daily, in the past six months, CCL manufacturers have raised product prices by about 20% to 30% due to the overall increase in upstream material prices. Most PCB manufacturers have not been able to pass on these costs quickly enough, resulting in a time lag of 2 to 3 months, which has eroded profit margins. Institutional investors indicate that starting from the third quarter of this year, some PCB manufacturers will increase prices, and the benefits are expected to drive a rebound in the profitability of related manufacturers.Analysts state that in terms of substrates, electronic fiberglass cloth led by T glass and copper foil drilling needles are still in short supply, with T glass experiencing the most severe shortage, with some manufacturers facing a gap of up to 20%. This gap is expected to continue into next year. It is anticipated that in the second half of this year, substrate manufacturers will enter a supply-demand imbalance driven by the high demand for AI GPUs and ASIC high-performance computing, as well as the continued tightness of key raw materials. Substrate manufacturers will continue to adopt rolling price adjustments, with prices still having double-digit upward potential.Additionally, due to the sustained high demand related to AI and the specification upgrades driven by new generation products, there is continued optimism that CCL manufacturers will benefit from both price and volume increases. With raw material prices remaining tight and the delivery times for high-end CCL continuing to extend, the trend of price increases remains unchanged. There is continued optimism for the future development of Taiwanese CCL manufacturers such as Taiflex and Taisil. Meanwhile, as the substrate gap gradually widens, it benefits the bargaining power of substrate manufacturers, and the trend of price increases will continue, maintaining a positive outlook on the future performance of Taiwanese substrate manufacturers, including Nanya Technology and other supply chain partners.

first_img TSMC accelerates its layout in CPO, and the industry is optimistic about forming a new Moore's Law

According to Taiwan's "Commercial Times" report on September 14, as the computing power of GPUs and ASICs continues to rise, traditional copper interconnects are gradually approaching the limits of power consumption and signal transmission. TSMC is accelerating its layout for co-packaged optics (CPO). The industry is optimistic that if CPO bandwidth continues to double every two years, it may form the "CPO Moore's Law" of the AI era. Industry analysis indicates that the upgrade of CPO bandwidth mainly has three paths: including increasing single-channel speed from 200G to over 400G, expanding the number of optical channels from 16 to 32, 64 or more, and introducing wavelength division multiplexing (WDM). By 2040, the theoretical value could reach about 128 times the current level, with long-term potential for development towards hundreds of T based on the current level of about 3.2T.TSMC's role in optical interconnects has extended from wafer foundry to system integration, gradually integrating computing, HBM memory, and high-speed I/O from 3DFabric, CoWoS, SoIC to silicon photonics and CPO. When high-speed electrical signals exceed 200G, signal attenuation increases after passing through longer copper paths such as ABF substrates, PCBs, and connectors, leading the industry to develop shorter copper paths and longer optical paths. In terms of packaging architecture, the optical engine is currently laid out on the substrate, and the next step is expected to place CPO in the intermediary layer, with future possibilities of using SoIC technology to achieve 3D vertical integration of photonic integrated circuits (PIC) and ASICs. Industry players indicate that CPO still needs to overcome challenges in packaging, optical coupling, and testing before mass production can be achieved.
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