BTC $77,220.74 -1.03%
ETH $2,466.23 -0.12%
BNB $713.76 -0.47%
XRP $1.35 -1.93%
SOL $99.85 -1.24%
TRX $0.3386 -0.25%
DOGE $0.0839 -1.43%
ADA $0.2080 -2.17%
BCH $227.15 -8.22%
LINK $11.51 -2.09%
HYPE $80.05 -3.56%
AAVE $122.94 -0.53%
SUI $0.7385 -3.07%
XLM $0.1766 -1.36%
ZEC $1,114.35 -7.92%
BTC $77,220.74 -1.03%
ETH $2,466.23 -0.12%
BNB $713.76 -0.47%
XRP $1.35 -1.93%
SOL $99.85 -1.24%
TRX $0.3386 -0.25%
DOGE $0.0839 -1.43%
ADA $0.2080 -2.17%
BCH $227.15 -8.22%
LINK $11.51 -2.09%
HYPE $80.05 -3.56%
AAVE $122.94 -0.53%
SUI $0.7385 -3.07%
XLM $0.1766 -1.36%
ZEC $1,114.35 -7.92%

大摩:AI 芯片封装需求强劲至 2028 年

2026-09-11 13:19:41

ChainCatcher 消息,摩根士丹利表示,儘管市場預期數據中心投資將放緩,但由於先進晶片封裝需求保持強勁,AI 半導體供應商的增長到 2028 年可能持續超過更廣泛的雲支出增長。

預計 2028 年先進封裝總產能將增長約 50%,而雲服務提供商的資本支出增幅為 12%。

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