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first_img Samsung Electro-Mechanics signed a supply contract for packaging substrates worth 360.5 billion Korean won

According to a report by THE ELEC, Samsung Electro-Mechanics announced on October 19 that it has signed a supply contract for packaging substrates for memory semiconductors with a large global company, amounting to 360.5 billion Korean won. The contract period is from January 1, 2027, to December 31, which is equivalent to 3.2% of the company's consolidated revenue last year.This is the first time Samsung Electro-Mechanics has disclosed a long-term supply contract for packaging substrates. With this addition, the number of long-term supply contracts disclosed by the company this year has increased to seven, with a total amount of approximately 4.3 trillion Korean won. Previous contracts were mainly focused on components such as silicon capacitors, multilayer ceramic capacitors, and inductors, and this expansion includes the packaging solutions business, which produces products such as FC-BGA substrates and BGA substrates.Last month, Samsung Electro-Mechanics announced plans to invest 42.7 trillion Korean won in the Sejong FC-BGA production facility and 25.1 trillion Korean won in the Vietnam packaging substrate production equipment. The company also stated that as part of a large government project, it plans to invest 80 trillion Korean won in the Sejong business site and 150 trillion Korean won in the Busan business site by 2040, and will produce FC-BGA in Busan, Sejong, and Vietnam. A related person from Samsung Electro-Mechanics stated that the growth of the AI and high-performance computing market makes high-performance packaging substrates more important, and the company will strengthen customer supply cooperation and establish a stable supply system.

first_img Samsung Electronics lowers the production of mid-range and low-end smartphones in the fourth quarter, as the supply of PCB raw materials is hindered

According to a report by ZDNet Korea on October 15, Samsung Electronics has lowered its production plan for mid-range and low-end smartphones in the fourth quarter. The reasons include rising prices of memory chips and disruptions in the supply of glass fiber used in PCB raw materials CCL. Japan's Nitto Denko is shifting more production capacity towards T-glass for AI semiconductors, reducing the output of E-glass for smartphone PCBs, leading to supply shortages and price increases. E-glass is used in semi-cured sheets for smartphone motherboards HDI and RFPCB.The report states that after the rise in storage prices increased manufacturing costs, Samsung reduced orders for related components. Models like the Galaxy A have lower profitability, making it difficult to significantly increase production. This year, the prices of basic mid-range models have risen by more than 100,000 Korean Won compared to the previous generation. The outlook for component orders communicated to partners for the fourth quarter corresponds to an annual smartphone shipment volume of just over 230 million units, which is below the component industry's expectation of 240 million units and represents a decrease of 20% to 30% compared to before the Mid-Autumn Festival holiday. Plans for the mobile business next year have not been shared with partners as in previous years.The monthly production outlook for the fourth quarter in mid-September was 14.3 million units in October, 9.5 million units in November, and 7.6 million units in December, totaling 31.4 million units. This was adjusted at the beginning of this month to 9.9 million units in October, 7.6 million units in November, and 6.7 million units in December, totaling 24.2 million units, a reduction of 23%. While the production of mid-range and low-end models has been lowered, the shipment plans for flagship models like the Galaxy S27 at the beginning of next year remain at a high level, and the shipment volume for foldable phones is also planned to increase. The MX and Network divisions reported a loss of 735 billion Korean Won in the second quarter, with the securities industry projecting an annual loss of 400 billion Korean Won.

DeepSeek plans to invest in the startup founded by Yu Tao, the head of the Pre-International Dynamics Model, with a valuation of 200 million USD

According to Top Chinese Innovation Society reports, former head of the basic model for humanoid robots at ZhiJi Dynamics, Yu Tao, has left to start his own venture, focusing on the combination of LLM and embodied intelligence. According to relevant sources, his company's first round valuation is 70 million USD, and the second round valuation is 200 million USD, with DeepSeek and a leading top-tier fund participating in the investment.Yu Tao holds a PhD from the University of Science and Technology of China and was a visiting scholar at the National University of Singapore. He previously served as a senior researcher in Tencent AI Lab's Absolute Enlightenment team, where he led the team to build the full-body tracking system LimX WBT and the motion generation system from scratch during his time at ZhiJi Dynamics. According to reports from Phoenix Technology, DeepSeek founder Liang Wenfeng has recently met with several entrepreneurs in embodied intelligence and is internally evaluating different entry methods, such as forming a team independently or investing in external startups.In August of this year, DeepSeek invested approximately 141 million RMB through a strategic placement in Yushu Technology for its IPO; previously, Bloomberg also disclosed its plan to lead the investment in the robotics company Winverse AI founded by former Tencent AI scientist Hu Han.
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