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first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.

first_img Brazilian Bank Expands Cryptocurrency Services, Regulatory Framework Takes Shape

Brazilian banks are expanding their cryptocurrency services for customers. According to Folha de S.Paulo, Brazil's largest asset management bank, Itaú, now offers 15 types of cryptocurrencies, including Bitcoin, Ethereum, and the US dollar stablecoin USDC, through its investment app. Brazil's largest fintech company, Nubank, has listed 28 types, and Banco do Brasil, the most profitable state-owned bank in Brazil, has seen transaction volumes exceed 11 million reais (approximately 2.1 million USD) since launching direct purchase services for Bitcoin and Ethereum in January of this year.However, customer cryptocurrency transactions have not entered the banks' balance sheets. A document from the central bank dated March 2026 shows that Brazilian banks hold zero virtual assets on their books. Over the past year, Itaú, Bradesco, Santander, Banco do Brasil, and Nubank have all expanded their cryptocurrency product lines, while the Brazilian cryptocurrency market has also reached record sizes. According to data from the Brazilian Federal Revenue Service, Receita Federal, Brazilians transferred 505.5 billion reais (approximately 98.7 billion USD) through cryptocurrencies in 2025, more than five times that of 2020, with corporate transactions accounting for 98.3%.This move by banks coincides with the implementation of regulations. In 2022, Brazil passed the "Virtual Asset Legal Framework," granting regulatory authority to the central bank. Three resolutions issued in November 2025 require any institution allowing customers to trade, hold, or send cryptocurrencies to obtain a license, meet minimum capital requirements, and segregate customer accounts, with a compliance deadline of October 30, 2026.

first_img Ethereum will include Frame Transactions in the 2027 upgrade, allowing users to pay Gas without holding ETH

According to CoinDesk, Ethereum core developers have included EIP-8141 (Frame Transactions) in the 2027 Hegotá upgrade plan. During the core developer call on August 27, the proposal was marked as "Scheduled for Inclusion," meaning it will become part of the network update rather than just a candidate proposal. Ethereum co-founder Vitalik Buterin, one of the ten authors of the proposal, stated on X on Sunday night that Frames have made significant progress in the past few months.Frames aim to address the issue where users hold stablecoins but cannot transfer them due to a lack of ETH. It splits transactions into independent steps such as authorization verification, fee payment, and instruction execution, allowing the sender and payer accounts to no longer have to be the same. For example, payment applications can cover fees themselves or settle ETH bills on behalf of users after collecting stablecoins, while the Ethereum network still prices in ETH, and users do not need to purchase ETH. Unlike existing wallet solutions that rely on third-party services, Frames will achieve this capability through the standard Ethereum transaction process.Additionally, Frames will bundle operations that need to be executed simultaneously, such as authorization and submission in token transactions, with authorization being revoked if the transaction fails; it also allows accounts to customize transaction approval rules, enabling the replacement of private keys or the adoption of quantum-resistant keys without needing to migrate funds to a new address. Currently, the specification is still a draft, and details may be adjusted before the Hegotá upgrade, with users unable to use Frames yet.

first_img SK Hynix accelerates the expansion of its 1c DRAM market share, becoming the main force by early next year

According to the Chosun Ilbo report on September 7, SK Hynix is accelerating the increase of the production share of 10-nanometer sixth-generation (1c) DRAM. Industry data shows that its 1c DRAM share rose from about 10% in the first quarter of this year to about 13% in the second quarter, and is expected to reach about 24% in the third quarter and about 34% in the fourth quarter; it may rise to about 35% in the first quarter of next year, surpassing 1b (about 33%) for the first time and becoming the main process. The share of 1b (10-nanometer fifth-generation) DRAM peaked at about 43% in the second quarter of this year and has since begun to decline.By the end of the second quarter, Samsung Electronics had a 1c share of about 16% and Micron about 19%, both higher than SK Hynix's approximately 13%. Reports indicate that SK Hynix is accelerating the transition in the second half of the year, and in the fourth quarter, it may exceed Samsung Electronics' approximately 31% with about 34%. SK Hynix stated in its second-quarter earnings call that the supply of DRAM using the 1c process will substantially begin from the second quarter, and in the second half of the year, with the ramp-up of HBM4 and increased shipments of 1c general DRAM, the bit growth rate will be higher than in the first half.Samsung Electronics will use 1c DRAM starting with HBM4, with a running speed of about 11.7Gbps; SK Hynix previously prioritized ensuring mass production stability with verified 1b DRAM and advanced MR-MUF packaging, and will use 1c DRAM for the first time as the core chip for HBM starting with the next generation HBM4E. Counterpoint Research and others estimate that this year, the market share of HBM4 under the combined metrics of Nvidia, Google, and AMD is approximately 50% for SK Hynix in the mid-range, 20% for Samsung Electronics in the later range, and 10% for Micron in the later range.
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