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first_img Musk's semiconductor project Terafab has contacted about 10 Korean companies

According to South Korean media THE ELEC, Tesla and SpaceX, under Elon Musk, are in contact with South Korean materials, components, and equipment companies for the semiconductor manufacturing project Terafab. Some companies have signed non-disclosure agreements and are discussing supply categories. From October 13 to 15, relevant personnel visited about 10 South Korean company booths at Semicon West 2026 in San Francisco to confirm products and capacities and propose follow-up discussions, many of which have been ongoing for several months.ENF Technology, Asflow, and G&G Intech are involved in this initial contact, focusing on process materials, piping parts and valves, and wastewater reuse equipment, respectively. Mico's cleaning subsidiary Komico signed a tripartite non-disclosure agreement with Tesla and SpaceX about a month ago to discuss cleaning services for the Texas R&D test line. Unisem signed a non-disclosure agreement regarding environmental protection equipment such as exhaust gas treatment, while Dongjin Semichem is discussing materials such as diluents and phosphoric acid related to the Texas plant. Hanmi Semiconductor is discussing thermal compression bonding equipment, HPSP will supply a high-pressure hydrogen annealing device to the R&D line, and testing socket company ISC is exchanging samples and design information.Terafab is located in Texas and was announced to be jointly promoted by Tesla, SpaceX, and xAI in March of this year. The independent legal entity and equity structure have not yet been disclosed. The goal is to reach a monthly production of 1 million wafers within 10 years, with an initial investment of $16.8 billion and the hiring of over 3,000 people. SpaceX signed a tax reduction contract with Texas earlier this month and has begun construction. The industry expects the initial facility, which will produce 100,000 wafers per month, to be completed before 2030. Initial uses include Tesla's autonomous driving and robotics chips, as well as SpaceX's satellite and space data center chips.

first_img SemiAnalysis: ASML is currently developing hybrid bonding equipment

On October 15, the semiconductor research organization SemiAnalysis published an article stating that the lithography equipment manufacturer ASML has not officially announced related products, but patents, news reports, and the company's roadmap all indicate that it is developing hybrid bonding equipment. The author of the article judges that ASML may first launch more challenging chip-to-wafer hybrid bonding tools and view it as an extension of vertical integration.Patents show that the system operates on a track, with each chip placed in an independent carrier, sequentially completing inspection, cleaning, plasma activation, morphology inspection, leveling, coarse alignment, position adjustment, and fine alignment before entering the bonding station; the final placement is completed by the carrier and suction cup. The track's repeat accuracy is about 10 microns, far from the approximately 50 nanometers required for bonding. ASML submitted 27 bonding patent families from December 2022 to November 2024, most of which are aimed at chip-to-wafer. The Elec reported in March that ASML has begun hybrid bonding machine architecture design with Prodrive Technologies and VDL ETG.The article states that wafer-to-wafer hybrid bonding has been used for image sensors and 3D NAND; chip-to-wafer is currently only used for mass production of logic chips, including AMD's hybrid bonding V-Cache shipped since 2022 and TSMC's SoIC. The current spacing of SoIC is about 6 microns, with a target of reaching approximately 4.5 microns by 2029. Besi is currently the only supplier with chip-to-wafer mass production tools, with related logic business mainly concentrated in TSMC and Intel.

SemiAnalysis: ByteDance accounts for nearly one-fifth of China's data center capacity

The semiconductor research organization SemiAnalysis released a survey on Chinese data centers, tracking over 1,000 facilities from more than 60 operators. The report estimates that by the end of 2026, China's data center capacity will exceed 24GW, second only to the United States' 56GW. ByteDance accounts for nearly one-fifth of this, making it the largest data center tenant in the country.ByteDance has leased over 4GW of data center capacity, with suppliers including Qinhuai Data, China United Network Communications, and Century Internet. The report states that by early 2026, ByteDance will still contribute about 90% of Qinhuai Data's revenue. ByteDance has also begun to accelerate its self-built data centers, constructing large facilities in Shanxi, Anhui, and Inner Mongolia to reduce reliance on external suppliers.The report also mentions that while Chinese data centers have long been considered to have a high vacancy rate, AI server rooms are still in short supply. This is due to many old server rooms lacking sufficient power supply and cooling capabilities, making it difficult to directly deploy high-power AI servers, while newly built large AI data centers are quickly being rented out. For example, a 100MW data center, excluding IT equipment such as servers, has a construction cost of about $300 million in China and about $1.5 billion in the United States, with Chinese facilities of the same scale typically delivered in about 12 months. Compared to the power supply and approval issues faced by the United States, the more prominent bottleneck for expanding AI data centers in China is the supply of advanced chips.

Morgan Stanley increased its holdings of BTC to a total of 9,261 coins, while the French semiconductor company Sequans completely exited

According to BBX data, last weekend, publicly listed companies in the U.S. and European stock markets disclosed the latest developments in digital asset allocation and treasury strategy adjustments. The core information is as follows:Morgan Stanley's ETF increased its holdings by nearly 43 Bitcoin, with a total holding value of $779 million: On-chain tracking data shows that Wall Street investment banking giant Morgan Stanley withdrew 42.979 Bitcoin from its subsidiary's spot Bitcoin exchange-traded fund MSBT on Saturday, extracting from the Coinbase Prime hot wallet address, valued at approximately $3.6 million based on the price at the time of withdrawal. Following this increase, Morgan Stanley's total Bitcoin holdings have now reached 9,261 BTC, with a total holding value of about $779 million.French semiconductor listed company Sequans liquidated 314 BTC, completely exiting its Bitcoin reserve strategy: French well-known semiconductor and IoT chip design listed company Sequans Communications disclosed that it has fully sold the 314 Bitcoin held on its balance sheet. This liquidation marks the company's official termination and complete exit from the previously established Bitcoin corporate treasury reserve strategy, and in the future, it will refocus its funds and liquidity on its core semiconductor business.

first_img French semiconductor company Sequans liquidated 314 bitcoins, exiting its bitcoin reserve strategy

French semiconductor company Sequans Communications has sold its last 314 bitcoins, completing its exit from the bitcoin reserve strategy, having previously held over 3,200 BTC. Sequans stated that this exit was conducted after the redemption of convertible bonds completed in May, allowing it to refocus on its core cellular IoT and software-defined radio business.Sequans CEO Georges Karam stated that the company used the proceeds from the bitcoin sales to pay off convertible bonds and strengthen its balance sheet. Currently, Sequans holds no cryptocurrency and has no outstanding debts other than government-funded R&D obligations. Sequans launched its bitcoin reserve strategy in June 2025, announcing a $384 million equity security and convertible secured bond issuance, with Karam at the time calling bitcoin a primary asset and an attractive long-term investment.The company began to reduce its holdings less than six months later, selling 970 BTC in November to redeem half of the convertible bonds. By May 2026, Sequans indicated that it would no longer pursue the reserve strategy and would gradually liquidate the remaining bitcoins. During the 2026 crypto bear market, an increasing number of digital asset reserve companies abandoned or scaled back their accumulation strategies. VanEck's head of digital asset research, Matthew Sigel, noted at the end of July that at least nine companies had completely liquidated or abandoned their bitcoin and cryptocurrency reserve strategies in 2026.

Ideal Semiconductor's subsidiary advances first round of financing with a pre-investment valuation of approximately 15 billion yuan

According to an exclusive report from Late Auto, the chip subsidiary of Li Auto is advancing its first round of external financing, with a pre-investment valuation of approximately 15 billion yuan, planning to raise several billion yuan. Business registration information shows that Mach Intelligent Cores Limited was established in Hong Kong on July 14, and on August 4, it fully established Shanghai Mach Intelligent Technology Co., Ltd., with Li Auto's CTO Xie Yan serving as the legal representative; a few days later, it also fully established Shanghai Mach Heart Technology Co., Ltd., with the legal representative being Li Auto's co-secretary Wang Yang.Li Auto's self-developed chip team consists of about 200 people, mainly engaged in AI computing architecture, chip design, and related software development, while advancing two types of self-developed chip projects for vehicles and the cloud. Its first self-developed chip, Mach M100, has entered mass production and is equipped in several new or updated models launched this year; another cloud inference chip is under development, also using a data flow architecture. In the first half of this year, financing in the domestic semiconductor sector amounted to approximately 162.7 billion yuan, with AI computing being one of the key areas for funding. For reference, NIO's chip subsidiary Anhui Shenji completed its first round of financing of 2.257 billion yuan in February this year, with a post-investment valuation of nearly 10 billion yuan.

first_img TSMC N2 mass production, Zhongsha Shengyang Semiconductor and other supply chains benefit

TSMC's 2-nanometer N2 mass production marks the transition of advanced semiconductor processes from FinFET to GAA generation. Industry analysts point out that with the simultaneous increase in process complexity, CMP track counts, wafer monitoring frequency, and material specifications, the demand for equipment, CMP consumables, reclaimed wafers, and advanced materials is rising, providing growth opportunities for suppliers like Zhongsha, Shengyang Semiconductor, Xinying Materials, and Songsheng. TSMC's N2 adopts nanosheet GAA technology, which can improve performance by 10% to 15% at the same power consumption compared to N3E, or reduce power consumption by 25% to 30% at the same speed, with chip density increasing by over 15%.In Zhongsha's largest customer Diamond Disk business, advanced processes account for 63%, with N3 and N2 each accounting for 22%, and 1.4 nanometers already shipped in small quantities; after N3 enters N2, the value of CMP content increases by 10% to 15%. Shengyang Semiconductor's monthly production capacity for reclaimed wafers is adjusted to 1.1 to 1.2 million pieces by the end of 2026, with a capital expenditure budget of 4.82 billion yuan for 2026, and it is estimated that the compound annual growth rate for reclaimed wafer expansion from 2025 to 2029 will reach 25% to 30%. Xinying Materials' core products Rinse, BARC, and EBR are expected to see shipments rise seasonally as N2 capacity ramps up, while Songsheng's semiconductor revenue accounted for 66% in the first half of the year, with a year-on-year increase of about 25%, and TSMC-related revenue increased by about 170% year-on-year.
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