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ChainCatcher reports, according to RootData market data, US stocks pre-market chip stocks up: LRCX.O up 9.8%, MRVL.O up 7.8%, KLAC.O up 7.5%, MU.O up 7.4%, AMAT.O up 6.7%, AMD.O up 6.6%, TSM.N up 6.3%, ARM.O up 6.2%, ASML.O up 5.4%, INTC.O up 5%, AVGO.O up 4.5%, NVDA.O up 3.4%, QCOM.O up 2.7%.

ChainCatcher reports, according to RootData market data, US stocks intraday chip stocks down: QCOM.O down 13.2%, ARM.O down 10.7%, AMD.O down 7.8%, LRCX.O down 6.6%, AMAT.O down 6.2%, KLAC.O down 5.9%, MRVL.O down 5.3%, MU.O down 4.6%, ASML.O down 4.2%, TSM.N down 4.1%, AVGO.O down 3.7%, INTC.O down 3.5%, NVDA.O down 2.4%.

ChainCatcher reports, according to Rootdata market data, US stocks pre-market chip stocks down: QCOM.O down 9.7%, AMD.O down 3.7%, ARM.O down 3.6%, LRCX.O down 3.6%, AMAT.O down 3.4%, MRVL.O down 3.3%, KLAC.O down 3.2%, MU.O down 3%, INTC.O down 2.7%, AVGO.O down 1.9%, TSM.N down 1.8%, ASML.O down 1.7%.

According to a report by Korean Electronic News on November 3, major global semiconductor equipment companies such as Applied Materials, ASML, Lam Research, Tokyo Electron, and KLA have entered the final stages of equipment supply contracts for 2028, with some companies also beginning discussions on procurement orders for equipment available in 2029. Industry insiders say that there is a surge in demand centered around front-end processes, with a desire to quickly move equipment into fabs. Core equipment partners of companies like TSMC, Micron, and Intel are formulating supply strategies for 2029, and some Korean equipment companies that directly trade with these overseas manufacturers are also reviewing supply plans for two to three years ahead.Discussions on wafer fab equipment supply contracts typically start 6 to 12 months before implementation, with delivery taking about 3 to 6 months after purchase orders are placed. Reports indicate that investment in artificial intelligence infrastructure continues, and semiconductor manufacturers are simultaneously advancing large-scale equipment investments, with equipment delivery times now more than doubled compared to usual, with some categories exceeding 2 years, and related contracts being pushed forward by 1 to 2 years compared to normal. ASML stated during its earnings announcement last month that it expects no interruptions in the supply of lithography equipment until 2028 and is also exploring plans to expand future capacity.An executive from a global equipment company stated that discussing equipment supply three years out at this point is unusual, and combined with the current state of fab investments, this trend is expected to continue until 2030. Another industry insider mentioned that global front-end and back-end investments are proceeding in parallel, and the trend of signing equipment import contracts earlier than competitors may spread to the back-end sector, prompting Samsung Electronics and SK Hynix to take measures to secure core process equipment in advance. Samsung Electronics and SK Hynix are currently continuing to advance their fab investments.

OKX will launch the USDC trading pairs for tokenized stocks xIREN and xASML on November 4. The xIREN/USDC spot trading will open at 17:30, and the xASML/USDC spot trading will open at 18:00.

ChainCatcher reports, according to Rootdata market data, US stocks intraday chip stocks up: MU.O up 3.2%, KLAC.O up 3%, LRCX.O up 2.9%, ARM.O up 2.4%, ASML.O up 2.4%, AMAT.O up 2.4%, NVDA.O up 2.3%, INTC.O up 2.3%, AMD.O up 1.9%, AVGO.O up 1.5%.

According to Bloomberg, Gerry Fowler, Chief European Equity Strategist and Head of Derivatives at UBS, stated that the market has underestimated the duration of the AI cycle, and AI trading remains robust. He pointed out that the valuation multiples of some hyperscale cloud vendors have fallen below 20 times, while revenue continues to grow by 10% to 20% annually, reflecting a rather pessimistic market expectation. Therefore, many investors are still willing to re-enter AI-related assets.Fowler believes that massive AI spending may be nearing a stage where it starts to yield returns, with a potential turning point in 2027: data center deliveries are expected to release backlogged orders, driving revenue to gradually catch up with capital expenditures. He mentioned that cash has not disappeared from the market but has shifted to suppliers like memory chip manufacturers, who are beginning to return cash to investors. The market pricing for memory chip companies also reflects what he believes is an overly short AI cycle.Regarding the next phase of beneficiaries, Fowler is more focused on global and European industrial companies that help build new factories. He noted that many infrastructure suppliers, such as those providing cables and electrical equipment, have orders booked through 2027 or even 2028, leaving limited room for upward revisions in profit forecasts. ASML benefits by supplying equipment to memory manufacturers like Samsung Electronics and SK Hynix, rather than directly supplying data centers; he stated that ASML and some European industrial companies are receiving upward revisions in expectations.

ChainCatcher reports, according to Rootdata market data, US stocks pre-market chip stocks up: MRVL.O up 2.9%, ARM.O up 2.7%, MU.O up 2.5%, LRCX.O up 2.5%, AMD.O up 2.2%, AMAT.O up 2.2%, TSM.N up 2.2%, KLAC.O up 2%, ASML.O up 1.7%.

ChainCatcher reports, according to Rootdata market data, US stocks intraday chip stocks down: INTC.O down 28.1%, ARM.O down 10.2%, AMD.O down 10.1%, MRVL.O down 7.4%, LRCX.O down 5.6%, MU.O down 5.5%, QCOM.O down 5.5%, ASML.O down 5.1%, AMAT.O down 4.7%, AVGO.O down 4.1%, TSM.N down 3.8%, KLAC.O down 3.6%, NVDA.O down 3.1%.

ChainCatcher reports, according to Rootdata market data, US stocks pre-market chip stocks down: INTC.O down 24.2%, ARM.O down 7.9%, AMD.O down 6.6%, MRVL.O down 4.9%, AMAT.O down 4.8%, LRCX.O down 4.5%, KLAC.O down 4.3%, MU.O down 4%, ASML.O down 4%, AVGO.O down 3.9%, QCOM.O down 3.8%, TSM.N down 3%, NVDA.O down 2.5%.

ChainCatcher reports, according to Rootdata market data, US stocks pre-market chip stocks up: MU.O up 4.4%, MRVL.O up 2.2%, INTC.O up 2.2%, AMD.O up 2%, ARM.O up 1.7%, ASML.O up 1.7%, AMAT.O up 1.6%.

Elon Musk revealed that ASML and other semiconductor equipment suppliers are accelerating the delivery of equipment for Tesla and SpaceX's Terafab chip project. Musk stated during SpaceX's third-quarter earnings call that he appreciates the suppliers for speeding up equipment delivery to help achieve the goals.The Terafab project aims to meet the demand for AI processors and other chips from Tesla and SpaceX, with plans to achieve large-scale chip production by 2028.

Semiconductor analyst Jukan shares a commentary translated into English by him, authored by a salesperson from a local Chinese sell-side institution. The individual states: In mid to late September, hardware quickly transitioned into a downward wave, with China and South Korea adjusting first, experiencing deeper declines and longer durations, followed by Japan, Taiwan, and the semiconductor ETF SOXX weakening subsequently; there is significant divergence in the market regarding whether AI is entering a mid-cycle collapse, but there is less controversy about the industry still advancing.The individual summarizes the views of interviewed investors: High long-term interest rates in the U.S., capital expenditures beginning to rely on external financing and competing for funds in the market, multi-layered leverage accumulation, and tight funding are the main reasons for this round of decline, with companies like CoreWeave experiencing a noticeable deterioration in financing structure and cost burden. Model invocation prices are decreasing, but capital expenditures and supply chain costs are difficult to reduce quickly, making short-term investment returns hard to realize. ASML and TSMC's guidance this season is strong, but near-term pressures cannot be ruled out; the bullwhip effect and differences in value chain levels may cause volatility to be greater than expected.The individual also mentions that use cases beyond coding are emerging in scenarios such as SaaS and AI drug development, which may gradually alleviate investment return concerns and expand demand. His personal judgment: Before more evidence emerges, the current situation resembles a high-volatility phase rather than a collapse that has already begun; the decline may not yet be over, and hardware leadership may give way to applications. Even if control of both houses changes in the midterm elections, the impact may mainly be limited to constraints on certain data center projects, and the U.S. earnings season needs to verify the performance of large technology companies.

On October 15, the semiconductor research organization SemiAnalysis published an article stating that the lithography equipment manufacturer ASML has not officially announced related products, but patents, news reports, and the company's roadmap all indicate that it is developing hybrid bonding equipment. The author of the article judges that ASML may first launch more challenging chip-to-wafer hybrid bonding tools and view it as an extension of vertical integration.Patents show that the system operates on a track, with each chip placed in an independent carrier, sequentially completing inspection, cleaning, plasma activation, morphology inspection, leveling, coarse alignment, position adjustment, and fine alignment before entering the bonding station; the final placement is completed by the carrier and suction cup. The track's repeat accuracy is about 10 microns, far from the approximately 50 nanometers required for bonding. ASML submitted 27 bonding patent families from December 2022 to November 2024, most of which are aimed at chip-to-wafer. The Elec reported in March that ASML has begun hybrid bonding machine architecture design with Prodrive Technologies and VDL ETG.The article states that wafer-to-wafer hybrid bonding has been used for image sensors and 3D NAND; chip-to-wafer is currently only used for mass production of logic chips, including AMD's hybrid bonding V-Cache shipped since 2022 and TSMC's SoIC. The current spacing of SoIC is about 6 microns, with a target of reaching approximately 4.5 microns by 2029. Besi is currently the only supplier with chip-to-wafer mass production tools, with related logic business mainly concentrated in TSMC and Intel.

Global leading chip equipment manufacturer ASML's Chief Financial Officer Roger Dassen stated that the company opposes a proposal in the U.S. Congress to restrict its sales of DUV lithography equipment to China, believing it is a bad idea. This statement came during a conference call with reporters following the company's third-quarter earnings release.Dassen said that if the Match Act is passed after the U.S. midterm elections, it will accelerate the development of competitive technologies within China. He also expressed optimism that common sense would prevail. Reuters described the Match Act as a U.S. Congressional proposal to limit ASML's sales of DUV lithography equipment to China.

Dutch semiconductor equipment manufacturer ASML has raised its full-year sales forecast for the third consecutive quarter, expecting sales in 2026 to be between 44 billion and 45 billion euros. Net sales in the third quarter rose to 11.66 billion euros.ASML plans to increase the production capacity of its low numerical aperture extreme ultraviolet lithography equipment by 30% next year and stated that it will not be able to fully meet market demand in 2027 and 2028.

Dutch semiconductor equipment manufacturer ASML is expected to announce its Q3 financial report on October 14. Driven by demand for AI chips, the market anticipates significant growth in revenue and profits compared to the same period in 2025. Wall Street analysts estimate Q3 revenue at 11.73 billion euros, a year-on-year increase of 55%; earnings per share are projected to be 10.76 euros, nearly doubling from 5.49 euros in Q3 2025.ASML's Q2 revenue was 9.3 billion euros, higher than 7.7 billion euros in the same period of 2025, with net profit increasing from 2.3 billion euros to 2.9 billion euros. The company estimates Q3 revenue to be between 11 billion and 12 billion euros, with a gross margin of 55% to 57%, and has raised its full-year revenue outlook to between 43 billion and 45 billion euros.ASML is the only manufacturer in the world that commercializes extreme ultraviolet lithography equipment. Foundries such as TSMC, Intel, and Samsung rely on its equipment to manufacture advanced AI processors, and the company is also developing the next generation of High-NA EUV. Intel has processed over 1 million wafers using this equipment in research, testing, and manufacturing, while Samsung plans to introduce it into advanced DRAM mass production by 2028. The market expects ASML to increase the capacity of its existing EUV systems by about 30% by 2027.

According to the South China Morning Post, former U.S. officials stated that Chinese semiconductor factories have stockpiled hundreds of immersion lithography machines worth billions of dollars in recent years and urged Washington and its allies to stop further exports. The Centre for Technology & Statecraft, established in August 2026, released a report in late September estimating that by early 2026, Chinese wafer fabs had acquired approximately 343 immersion deep ultraviolet lithography systems. The report was co-authored by former U.S. export control official Nicholas Brown and former White House and Department of Commerce technology policy advisor Saif Khan.The report estimates that about 270 of these are ASML Twinscan NXT:1980i. The authors claim that although these devices lag behind extreme ultraviolet lithography machines, they can be modified for the production of 7-nanometer logic chips and advanced memory required for artificial intelligence processors (including Huawei's Ascend series). Chinese wafer fabs spent over $13 billion in 2024 to purchase about 90 NXT:1980i units, and acquired another 89 units in 2025. ASML disclosed that, by destination, China accounted for 41% of its net system sales in 2024, 33% in 2025, dropping to 19% in the first quarter of 2026 and 14% in the second quarter.Since September 2023, the Netherlands has required export licenses for the NXT:2000i and more advanced immersion deep ultraviolet equipment, effectively banning these models from being shipped to China; a year later, the licensing requirements were extended to the NXT:1980i, but this model can still be approved for shipment on a case-by-case basis.

Frank Heemskerk, Executive Vice President of the Dutch lithography machine company ASML, stated that the company currently does not sell any chip manufacturing equipment on the European continent. He said, "We are not selling anything in Europe at all. This is because there has been no investment in Europe, and there are no new chip factories being built here."Data shows that in the second quarter of this year, Europe's contribution to ASML's net system sales was zero, and by 2025, Europe, the Middle East, and Africa will account for 1%. In the first half of the year, South Korea was the company's largest market for equipment. Heemskerk stated that other countries are rolling out the red carpet to invite investment in factory construction, and currently about a quarter of ASML's R&D work is conducted in the United States.The European Union is reforming the "Chip Act," which will take effect in 2023. In May of this year, ASML signed an agreement with Tata Electronics of India to assist India in building semiconductor factories.