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Ultraman introduced three paths for employees to develop safe super AI

OpenAI CEO Sam Altman introduced three proposals for the safe development of super AI to employees last week. The first is to establish a global regulatory organization similar to the International Atomic Energy Agency, to inspect advanced models and audit safety measures. Insiders say Altman leans towards this route.The second proposal emulates the European Organization for Nuclear Research, merging major AI laboratories into one organization or collaborating through a unified agency for joint development, rather than continuing to race against each other. The third and most extreme, which he referred to as the "Eliezer Plan": an AI company achieves recursive self-improvement first, and then uses overwhelming economic power to control computing power, making it impossible for other developers to catch up. Altman described this idea as "melting down all other companies' GPUs," while stating that this plan is very bad and is only meant to illustrate the extreme possibility.The idea of "melting down GPUs" comes from AI safety researcher Eliezer Yudkowsky. He proposed a thought experiment in 2021, suggesting that super AI could create self-replicating nanomachines to melt down global GPUs, stating that this is merely an extreme example to illustrate the intensity of intervention, not a proposal to be executed. OpenAI proposed the establishment of an "AI version of the International Atomic Energy Agency" in 2023, and Google DeepMind head Hassabis has also advocated for the creation of an "AI version of CERN." Currently, OpenAI, Google, and Anthropic plan to establish a joint safety standards organization by the end of this year or early next year, but there are disagreements over the responsibility for model safety testing. Altman hopes to set speed limits for AI development while stating that OpenAI cannot currently cede its competitive advantage to rivals.

first_img Qualcomm's next-generation AP overheating, Samsung may bring Exynos back to Ultra

According to a report by Seoul Economy on the 16th, Samsung Electronics is experiencing performance degradation due to overheating in Qualcomm's next-generation application processor intended for the high-end model Galaxy S27 Ultra, which is set to be released early next year. The MX division of Samsung's DX department is conducting final performance validation on the Qualcomm Snapdragon 8 Elite Extreme 6th generation that will be equipped in this model and has requested Qualcomm to resolve the overheating issue by mid-month.Several related individuals stated that the chip repeatedly exceeded temperature benchmarks during recent internal testing, leading to a decrease in processing speed under sustained high load. Samsung informed Qualcomm of the results last month, and as of the report, the overheating stability required by Samsung has not yet been achieved, with both parties still working to enhance performance and revalidate. This chip is Qualcomm's highest-end mobile application processor publicly announced last month, focusing on handling complex AI tasks on the device side and improving the performance of the CPU, GPU, and more.Mass production of the Galaxy S27 series is scheduled for the end of this year, and Samsung plans to confirm the results of the overheating improvements and finalize the application processor selection by mid-month. If the standards are met, Snapdragon will be used as originally planned; if not resolved, the Exynos 2700, designed by Samsung's System LSI and utilizing the second-generation 2-nanometer process SF2P from its foundry division, may be considered as an alternative. Since the global use of Qualcomm application processors began with the Galaxy S23 Ultra in 2023, if the Exynos 2700 is adopted in next year's Ultra, it will mark a return to the highest-end model after about five years since 2022. Industry insiders indicate that Qualcomm's application processor has not been completely ruled out.

first_img Analysis: China may have stockpiled 343 immersion deep ultraviolet lithography machines

According to the South China Morning Post, former U.S. officials stated that Chinese semiconductor factories have stockpiled hundreds of immersion lithography machines worth billions of dollars in recent years and urged Washington and its allies to stop further exports. The Centre for Technology & Statecraft, established in August 2026, released a report in late September estimating that by early 2026, Chinese wafer fabs had acquired approximately 343 immersion deep ultraviolet lithography systems. The report was co-authored by former U.S. export control official Nicholas Brown and former White House and Department of Commerce technology policy advisor Saif Khan.The report estimates that about 270 of these are ASML Twinscan NXT:1980i. The authors claim that although these devices lag behind extreme ultraviolet lithography machines, they can be modified for the production of 7-nanometer logic chips and advanced memory required for artificial intelligence processors (including Huawei's Ascend series). Chinese wafer fabs spent over $13 billion in 2024 to purchase about 90 NXT:1980i units, and acquired another 89 units in 2025. ASML disclosed that, by destination, China accounted for 41% of its net system sales in 2024, 33% in 2025, dropping to 19% in the first quarter of 2026 and 14% in the second quarter.Since September 2023, the Netherlands has required export licenses for the NXT:2000i and more advanced immersion deep ultraviolet equipment, effectively banning these models from being shipped to China; a year later, the licensing requirements were extended to the NXT:1980i, but this model can still be approved for shipment on a case-by-case basis.

first_img Ultraman is concerned that AI may fall into the hands of a few powerful individuals, stating that some people are overly anxious

According to Business Insider, OpenAI CEO Sam Altman expressed in the David Senra podcast that he is concerned that AI may one day be controlled by a few companies, models, or individuals, causing the vast majority of consumers to lose their voice in how technology shapes the world. He stated that the correct approach is to ensure that people firmly control the future, and society and models will evolve together.Altman is also worried about AI escaping human control. He pointed out that an excessive fear of the latter risk could lead to the former situation becoming a reality, as some advocate sacrificing a significant amount of freedom for security out of anxiety. The article suggests this may indirectly refer to Anthropic CEO Dario Amodei, who has repeatedly warned about AI risks and called for increased government regulation. Anthropic is the only mainstream AI company that has not signed the open letter supporting open-weight models.Although OpenAI has not yet open-sourced its cutting-edge models, it released two open-weight models last year: gpt-oss-120b and gpt-oss-20b. Altman also stated that U.S. AI leaders have failed to adequately demonstrate to the public how the technology enhances life autonomy, and he anticipates the largest wave of entrepreneurship, as AI is empowering more people to start small businesses.

The ULTRA Web3 Festival in Kuala Lumpur has successfully concluded and will join hands with Web3Labs to showcase at the GWDC 2026 conference in South Korea

The ULTRA Web3 Festival successfully concluded on July 30-31 at The Arch Galeries in Kuala Lumpur. As the core site of the "Global Series Conference Integrating Web3, Traditional Finance, and Artificial Intelligence," this two-day summit brought together international builders, business leaders, and institutional investors to build a bridge between decentralized technology and traditional markets.The success of the Kuala Lumpur event was attributed to the support of a wide range of visionary alliances and industry-leading sponsors, including Pudgy Penguins, Orca, DDNEXUS, Alpha Insight, AI Nova, Decentralized Intelligence, SuperFlow, CloudBank, Morpheus, Razer, ChainUp, DYLI, Saat Dimensi, Oper8 Capital, Lavo Protocol, WageFlow, Echobit Exchange, LifyX Exchange, X18, and Starshine. Additionally, the event further expanded its influence through strategic collaboration with key ecosystem partners such as Access Blockchain Association, CCACC, Emerge Group, Global Impact Fintech, Web3Labs, and ADI Foundation.It is reported that the ULTRA Web3 Festival is set to enter the South Korean market, partnering with Web3Labs as the official global business partner to appear at the second Global Web3 Developers Conference (GWDC 2026 Korea). The conference is scheduled to take place on September 29-30 at the aT Center in Seoul, where both parties will promote cross-border collaboration, technology exchange, and drive international business growth in the Asia-Pacific region.

hot_img TrendForce: DRAM supply tightness will continue until 2027, Nvidia assesses and lowers Rubin Ultra HBM configuration

According to the latest research by TrendForce, the tight supply of DRAM is expected to continue until 2027, and the uncertainty of the HBM4e verification schedule is prompting AI chip manufacturers to consider reducing the HBM configuration of their next-generation products. Starting from Q3 2026, NVIDIA has begun evaluating the HBM solution for Rubin Ultra, expanding from the original 12-Hi HBM4e to alternative options such as 8-Hi HBM4e, 12-Hi HBM4, and 8-Hi HBM4, with the final specifications yet to be determined. Previously, due to the expected supply bottleneck of LPDDR5X lasting until 2027, NVIDIA decided to halve the SOCAMM capacity of the next-generation Vera Rubin Superchip module.TrendForce pointed out that the main reasons for the downgrade of Rubin Ultra from 12-Hi HBM4e include: the overall DRAM shortage in 2027 will limit the allocation of wafer capacity to HBM, and there is still uncertainty regarding the mass production schedule and yield ramp-up of 12-Hi HBM4e. It is expected that the HBM bit shipment volume in 2027 will increase by approximately 50-60% year-on-year, which will still be insufficient to meet the growth in demand. HBM suppliers will maintain pricing power throughout 2027, and HBM prices are expected to rise significantly. The final configuration will depend on the wafer allocation decisions of memory suppliers.
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