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first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

first_img The Singapore Exchange has opened Bitcoin and Ethereum perpetual contracts to U.S. institutions

The Singapore Exchange (SGX) has received authorization from the U.S. Commodity Futures Trading Commission (CFTC) under the Regulation 48.1 framework to open its Bitcoin and Ethereum perpetual contracts to U.S. institutional investors. KC Lam, Head of Crypto Derivatives at SGX Group, stated that previously U.S. participants were unable to trade these contracts, but they are now permitted direct access to its trading system.Since its launch at the end of November 2025, SGX's crypto perpetual contracts have accumulated a trading volume of $5.8 billion (approximately 400,000 lots), with an average daily trading volume of 1,300 lots ($19 million) as of August. Bitcoin accounts for 66% of open contracts and 83% of average daily trading volume, with a single-day peak trading volume of 11,500 lots (notional value of $145 million). Lam indicated that as the FIS backend integration is fully ready, they will assist U.S. clearing members in onboarding clients in the next month or two.Unlike crypto-native platforms, SGX's perpetual contracts have no expiration date but employ a margin call and collateral top-up mechanism instead of automatic liquidation, separating trading and clearing based on traditional futures market infrastructure. Stablecoins are not accepted as collateral, and the contract benchmark index is jointly developed by SGX and CoinDesk Indices. SGX's next step is to launch Bitcoin and Ethereum futures and options.
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