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first_img TrendForce: The top ten foundry revenues before the second quarter of 2026 are nearly 53.49 billion USD

TrendForce's latest research on the wafer foundry industry shows that in the second quarter of 2026, the total revenue of the world's top ten wafer foundries increased by 11.5% quarter-on-quarter, approaching $53.49 billion, setting a new record. The growth mainly comes from the continued demand exceeding supply for advanced processes in AI and HPC processors, as well as the rising demand for peripheral AI chips such as PMICs and power discrete devices; the early stocking of consumer supply chains for TVs, PCs, and laptops has also tightened the capacity of some mature processes.TSMC continues to lead, with revenue nearing $40.2 billion in the second quarter, a quarter-on-quarter increase of 12.1%, and a market share of 72.5%. The demand for AI server GPUs and XPUs has kept its 5/4 nm and 3 nm capacities fully loaded, and the initial stocking of the new iPhone has also contributed, with 2 nm making its first revenue contribution. Samsung Foundry ranks second, with revenue of $3.26 billion, a slight quarter-on-quarter increase of 1.8%, and a market share dropping to 5.9%. SMIC ranks third, with revenue exceeding $3 billion, a quarter-on-quarter increase of 20%, and a market share rising to 5.4%, narrowing the gap with Samsung.UMC maintains fourth place, with revenue of nearly $2.18 billion, a quarter-on-quarter increase of 12.7%, and a market share of 3.9%. GlobalFoundries is fifth, with revenue of approximately $1.79 billion, a quarter-on-quarter increase of 9.3%, and a market share of 3.2%. Hua Hong Group ranks sixth, with revenue exceeding $1.27 billion, a quarter-on-quarter increase of 3.5%. Tower, World Advanced, Jinghe Integrated, and Powerchip rank seventh to tenth, with revenues of $460 million, $451 million, $447 million, and $432 million, respectively.

first_img Analysis: 91% of the YC 2026 Summer Batch are AI companies, with the application layer's proportion dropping to 39%

User chris__lu posted that they compiled all 236 companies and 470 founders from the YC Summer 2026 batch, categorizing each company into an AI technology stack layer and comparing it to the Spring batch using the same criteria. This batch still has 91% related to AI. The model companies increased from 8% to 20%, the application layer decreased from 55% to 39%, horizontal applications dropped from 58 to 32, and vertical applications remained at 25%.In the Spring, 45% of companies delivered autonomous agents, while in the Summer, it was 33%, with "agent" in a one-sentence introduction dropping from 27% to 19%. 21 companies are engaged in computational infrastructure, 11 focus on inference costs, and there are also companies for training data and reinforcement learning environments. Scale AI is listed as an alternative target by 8 companies. The industrial category increased from 12% to 24%, with 45 companies delivering physical products, 24 being robots or physical AI, and 21 companies operating their own businesses rather than selling software.This batch is the youngest, with 37% of founders being students or graduates in the last two years, 59 teams are entirely student teams, the dropout rate increased from 3% to 9%, and repeat founders decreased from 32% to 23%, with 84% having a technical background. 39 from Berkeley, 32 from MIT, and 25 from Stanford. Amazon is the largest source of talent. Sales and marketing AI decreased from 18 to 6. Only 19 founders come from AI labs, accounting for 4%. 8 founding teams come from the same previous employer.

first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.
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