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first_img TSMC will start mass production using ASML's high NA EUV lithography machines in 2030

On September 8, TSMC announced that starting in 2030, it will adopt a new "high NA" extreme ultraviolet (EUV) lithography machine manufactured by ASML from the Netherlands for mass production. Both parties also stated that they will carry out industry-wide improvements on the high NA machines. ASML monopolizes the supply of EUV lithography machines used to form nanoscale ultra-fine circuits and will begin shipping high NA machines capable of drawing finer circuits starting in December 2023. Intel has already introduced high NA machines, while TSMC previously delayed mass production due to high costs and other reasons.TSMC and ASML will launch an industry-wide project to enlarge the photomask, which serves as the original circuit pattern, from the current 6-inch (approximately 15 centimeters) square to a 12-inch square, and develop high NA machines and related components corresponding to the large masks. A large mask pilot production line is planned to be established before 2031, and the high NA machines corresponding to the large masks are expected to reach a state suitable for advanced semiconductor production before 2033. Major semiconductor manufacturers and mask companies have expressed interest in participating.High NA machines can draw finer circuits, but the area that can be drawn in a single exposure is reduced to half that of traditional models, requiring multiple exposures for large chip circuits, which complicates the process and increases costs. Enlarging the photomask can expand the exposure area and reduce costs. TSMC Chairman and CEO C. C. Wei stated that the company will gather expertise from the entire industry to continuously promote technological innovation that makes advanced technology widely usable and convey its benefits.

hot_img Domestic immersion DUV lithography machines have started small batch production, with plans to deliver about 5 units this year

According to a report by The Information citing informed sources, a Shanghai state-owned company whose name has not been disclosed has begun producing domestically-made immersion DUV lithography machines, planning to manufacture about 5 units this year and increase to about 20 units by 2027. The first batch of equipment will be delivered to major foundries such as SMIC, Hua Hong Semiconductor, and ChangXin Technology, but the equipment still needs to undergo verification for accuracy, stability, and production line compatibility, a process that may take several months or even longer.Currently, most components of the equipment come from domestic sources, but some key parts still rely on Japan, and the performance and manufacturing quality lag behind ASML. In comparison, ASML is set to deliver about 131 immersion DUV lithography machines as early as 2025. Although domestic equipment has made the leap from prototype testing to small-scale production, there is still a significant gap before it can replace ASML on a large scale. Previously, Reuters reported that the U.S. is considering tightening restrictions on the export of lithography equipment to China and on maintenance services in China, and the delivery of domestic equipment coincides with this backdrop.

X-Agent has joined the OKX Agent Marketplace, launching the first batch of MCP tools to create a machine-native economic closed loop

The AI Agent no-code operating platform X-Agent based on Web3 social networks has officially become a merchant in the OKX Agent Marketplace, launching three production-level risk analysis MCP (Model Context Protocol) tools, and deeply integrating with OKX Onchain OS and OKX Agentic Wallet, promoting the evolution of AI Agents from mere software logic to entities with autonomous economic behavior capabilities.The first batch of three pay-per-use MCP tools:X-Agent encapsulates the underlying risk assessment capabilities verified by the platform into standard MCP services for other Agents within the ecosystem to automatically discover and call:Token Security Scan: Identifies Rug Pull, Pi Xiu schemes, and contract restriction risks (0.03 USDT / use).Wallet Reputation: Evaluates the historical behavior of counterparties and "smart money" (0.01 USDT / use).Portfolio Health: Analyzes position concentration and volatility risks (0.01 USDT / use).Deep integration with the OKX ecosystem architecture, enabling machine micropayments:x402 machine-native settlement: Combines gas-free USDC settlement based on EIP-3009 with the Coinbase x402 protocol, achieving minimal per-use payments as low as 0.01 USDT on OKX X Layer, without the need for pre-deposit or manual approval.OKX TEE hardware-level custody: Integrates with OKX Agentic Wallet, storing private keys within OKX TEE (Trusted Execution Environment), with X-Agent authorized only through short-term session signatures, ensuring asset security from the source.Idempotent automated execution: Introduces Pre-Broadcast protection and idempotent state machines to prevent duplicate charges or state conflicts in on-chain autonomous tasks.Building a "two-way cycle" Agent economy:This collaboration marks the realization of a full-path connection in the X-Agent architecture from "identity - payment - execution - monetization - distribution." Agents can autonomously procure external services through OKX Agentic Wallet and package their capabilities into paid MCP tools to earn revenue, truly achieving a value closed loop for a decentralized Agent economy.
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