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first_img Samsung and SK Hynix respond to HBM4E heat dissipation, AI intermediary layer may expand to 40 times

TrendForce reported on October 12, citing Chosun Biz, that as AI packaging accommodates more computing and storage chips, the intermediary layer connecting computing chips and HBM is expected to significantly increase in size, making next-generation HBM cooling more important. Samsung Electronics is preparing multiple technologies to address the cooling challenges of HBM4E, which is scheduled to begin mass production next year.Currently, the area of the AI intermediary layer is about 5.5 times the maximum exposure area of 858 square millimeters of an EUV lithography machine. Semiconductor equipment industry insiders expect that the intermediary layer carrying HBM could expand to 9 times, 12 times that area, and ultimately about 40 times. Reasons include limitations in process miniaturization and the popularity of chiplet-style 2.5D packaging, where multiple computing chiplets and HBM stacks are placed on the same intermediary layer, making it difficult for a single advanced process chip to meet AI computing power demands.Samsung is considering hybrid copper bonding and thermal path blocks. The former replaces the micro bumps between stacked DRAM chips with direct copper-to-copper connections, which can reduce inter-layer gaps, make the stack thinner, and improve heat dissipation, a technology Samsung showcased at NVIDIA GTC in March 2026. The thermal path block establishes a dedicated thermal path in the D2D PHY area responsible for high-speed transmission between HBM base chips and GPUs, which Samsung is validating with HBM4E and plans to implement in HBM5. According to ETNews, SK Hynix's iHBM places high thermal conductivity but electrically insulating cooling materials around the heat-concentrated D2D PHY, which is expected to reduce thermal resistance by about 30%.

first_img Core Lightning warns that old version nodes are under attack and urges operators to upgrade immediately

The Core Lightning team, which develops the open-source Bitcoin Lightning Network node software, has issued an urgent alert stating that reports indicate attackers are targeting nodes that have not installed patches, urging operators still running old versions to upgrade immediately. The team stated: "Emergency security update: If you are using version 26.06.7 or earlier, please upgrade to the latest release as soon as possible."Prior to this, Core Lightning began investigating a potential issue that could affect its experimental features and, in turn, impact user funds on September 16, and approximately six days later, version 26.06.8 was released. This update not only fixed several defects but also provided patches for security vulnerabilities reported responsibly by multiple parties, thanking the Bitcoin Red Team and 12 other individuals and organizations in the release notes, while also acknowledging anonymous reporters.According to the changelog, this round of fixes covers a bug that could cause sender nodes to crash, requests that could exhaust REST interface memory, and a vulnerability that could result in user funds facing confiscation losses when closing payment channels. To provide operators with ample upgrade windows and prevent attackers from taking advantage of reverse engineering and exploitation, this version intentionally obscured some testing content. Additionally, in August of this year, the project initiated a collaborative fixing process after reviewing a large number of AI-generated general vulnerability disclosure reports, and two days later released version 26.06.7 to close confirmed vulnerabilities.
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