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first_img Market news: It is rumored that TSMC is investing over 30 billion yuan to acquire AUO's two factories, laying out the CPU ecosystem

According to the Industrial and Commercial Times, there are widespread rumors in the market that TSMC intends to invest over 30 billion New Taiwan dollars to acquire AUO's two old-generation panel factories, L7 and L5C, located in the Central Taiwan Science Park, adjacent to TSMC's plant, to reserve space for large-size packaging such as CoPoS and FOPLP. Informed sources indicate that TSMC has sent personnel to complete on-site audits, and AUO plans to prioritize the disposal of the two factories, aiming to submit to the board of directors in October, with an estimated completion of production line relocation and factory vacating by the end of the first quarter next year. Both TSMC and AUO have not confirmed this transaction.Semiconductor industry analysts suggest that TSMC is extending from the A14 advanced process and advanced packaging to the COUPE silicon photonics platform, leveraging Taichung's role as a hub for precision optical components to build the Central Taiwan Science Park into a CPO ecosystem. TSMC's existing Fab 15A in the Science Park mainly uses a 28-nanometer process and can support the manufacturing of silicon interposers; the second phase of the Science Park, Fab 25, is planned to build four A14 wafer fabs, with the first two already entering steel structure construction, and the first factory striving for completion before April 2027. The existing advanced packaging and testing facility AP5 in the Science Park has already started CoWoS production, and in the future, it will integrate electronic and photonic chips through the COUPE platform.On the optical side, Largan Precision has recently acquired land and factories in Nantun, Taichung Industrial Zone, and nearby precision machinery clusters, with three transactions totaling approximately 2.568 billion, interpreted by the market as a warm-up for CPO mass production. The company has obtained its first mass production order for fiber optic arrays, with the first automated trial production line aiming for completion by the end of the third quarter, and mass production expected as early as mid-2027, while also laying out micro-lens arrays and integrated FAUs.

first_img Counterpoint predicts that Samsung will regain its leading position in the smartphone market this year

Counterpoint Research predicts that Samsung Electronics will regain its leading position in the smartphone market this year, indicating its stronger resilience against rising memory chip prices. Since the beginning of this year, the shortage of memory supply has become increasingly severe, and Counterpoint expects global smartphone shipments to decline by 14.3% by 2026. Samsung, with its highly integrated supply chain and mature distribution network, is an exception, with expected shipment growth of 0.8%, outperforming other manufacturers.Counterpoint states that the overall smartphone market is expected to decline again in 2027, followed by a recovery the next year. Similar to Samsung, Apple is expected to withstand the pressure from rising component prices, but the agency is more cautious about Apple's outlook. Apart from Samsung, only China's Huawei has established its own hardware supply system, which is expected to maintain significant growth.Counterpoint's chief analyst points out that the key to Samsung's return to the top lies in its internal component manufacturing capabilities, diverse product line, and solid relationships with carriers and retailers. It is expected that leading smartphone manufacturers in China will face greater shipment pressure, and the acceleration of industry consolidation during the economic downturn remains its fundamental forecast.

first_img Italian Central Bank Study: Stablecoin Remittances Have No Systemic Cost Advantage, On-chain Components Only Account for a Small Portion

In a research report released by the Bank of Italy in July 2026, a "mystery shopper" empirical investigation was conducted for the first time, tracking 200 USDC transfers across ten corridors between Italy and Argentina, Brazil, South Africa, the UAE, and Japan. The results showed that the total cost of stablecoin remittances fluctuated greatly, with a minimum of only 0.3% and a maximum close to 9%. On-chain transfers accounted for an average of only 0.4%, with the bulk of costs concentrated in fiat withdrawal and deposit stages—traditional intermediary fees such as exchange buy-sell spreads, credit card fees, and withdrawal fees were the decisive factors. Compared to traditional channels like Wise, stablecoins have a cost advantage in some corridors like Brazil to Italy, but the costs are higher in corridors like UAE to Italy, showing a high degree of "corridor specificity."In terms of speed, blockchain transfers themselves take only a few minutes, but end-to-end efficiency entirely depends on the quality of the traditional payment infrastructure in the destination country. Countries with instant payment systems, such as Brazil (PIX), Italy (TIPS), and Argentina (Transferencias 3.0), can keep the entire process under 20 minutes; whereas countries like South Africa, which rely on traditional bank transfers, see the arrival time extended to 1 to 2 business days. The report pointed out that the efficiency of stablecoin remittances is jointly determined by their own infrastructure and the surrounding traditional payment infrastructure, with both being complementary rather than substitutive. The report also analyzed the impact of global regulatory fragmentation: the EU's MiCA and the US's GENIUS Act represent mature compliance frameworks; Japan's strict "safety first" access, while lowering nominal costs, complicates processes leading users to offshore platforms; countries like India and Turkey are in a transitional regulatory phase; while countries like Egypt and Saudi Arabia, with prohibitive measures, have failed to suppress demand, instead pushing transactions into gray channels.

first_img Optimism transfers 546.9 million OP airdrop reserves to the strategic fund

Optimism governance has approved a proposal to transfer 546.9 million OP tokens (valued at approximately $49.7 million at the time of voting) originally reserved for future user airdrops to a strategic ecosystem fund managed by the Optimism Foundation. This move cancels the remaining dedicated airdrop pool and authorizes the foundation to use the tokens for collaborative transactions, incentives, and other initiatives to promote the growth of OP Mainnet and OP Enterprise. The proposal clearly states that there are currently no additional airdrop plans, and the tokens distributed in Airdrop 1 to 5 are unaffected.On-chain voting ultimately passed with 17.974 million OP in support and 10.931 million against. The core development team Test in Prod cast 8.486 million OP in favor about 17 minutes before the end of voting, raising the support rate from 45.77% to 61.84%; without that vote, the support rate would have been only 46.47%. The team claims to be fully funded by the Optimism Collective and has been involved in the development of OP Stack execution clients, network upgrades, and fault proofs since 2022.The Foundation stated that it has distributed 269.1 million OP through five airdrops, but broad user acquisition no longer aligns with the current institutional strategy. The new fund can support transactions related to chains, protocols, institutions, and infrastructure, as well as incentives for OP Mainnet activities and liquidity. Some representatives believe the authorization is too broad, and the L2BEAT governance team is calling for clearer deployment expectations, evaluation methods, and success criteria. The foundation will update public token accounting and disclose cumulative deployment status in the annual budget report.

Optimism governance vote sparks controversy: 5.469 million OP tokens transferred from user airdrop to ecological fund

According to CoinDesk, a governance proposal from the Optimism community has been approved, reallocating 546.9 million OP tokens originally planned for user airdrops to the "Strategic Ecosystem Fund" managed by the Optimism Foundation, sparking discussions in the community about governance transparency and user rights. The OP tokens involved account for approximately 12.7% of the total supply, valued at about $49.7 million at current prices.The Optimism Foundation stated that as the ecological strategy shifts towards institutional adoption and corporate partnerships, large-scale user airdrops are no longer fully aligned with the current development direction. Unused tokens can be utilized for ecosystem incentives, partnership building, and enterprise-level project expansion. The final vote resulted in 17.974 million OP in support and 10.931 million OP against the proposal.A key turning point occurred 16 minutes and 52 seconds before the voting ended, when the Optimism core development team Test in Prod (delegate.testinprod-io.eth) cast 8.486 million OP in support, raising the approval rate from 45.77% to 61.84%, ultimately pushing the proposal through.If the vote from Test in Prod were excluded, the support rate for the proposal would only be 46.47%, which would not have passed, and the related tokens might have remained in the user allocation pool. The Optimism Foundation previously committed to disclosing the cumulative usage of the fund and related results through an annual budget report. This vote has also reignited discussions about the influence of "large delegated voting rights" in DAO governance and the balance of rights for token holders.

first_img Market news: Intel's Razor Lake may adopt TSMC's N2X process

According to the Industrial and Commercial Times, competition in advanced process technology for PC processors is heating up. Market news indicates that Intel's next-generation Nova Lake desktop processor will prioritize the introduction of bLLC large last-level cache to reduce access latency to system memory, competing with AMD's 3D V-Cache technology; the laptop version may be delayed until the subsequent Razor Lake-HX generation is released. The supply chain reveals that Nova Lake, set to debut early next year, will utilize a combination of Intel's 18A and TSMC's N2P processes, while the subsequent Razor Lake may further adopt TSMC's high-performance 2-nanometer N2X process.N2X is a high-performance extension of TSMC's N2 platform, targeting high-frequency CPUs, AI, and HPC applications, with transistor technology shifting from FinFET to nanosheets. If mass production is achieved, Intel's collaboration with TSMC on advanced processes is expected to extend to a broader 2-nanometer family, helping to reduce risks associated with a single proprietary process and optimize the timing and capacity configuration for high-end CPU launches.In addition to TSMC benefiting directly, related supply chains are also expected to welcome business opportunities. Sungsan is one of the few manufacturers in Taiwan capable of mass-producing its own CMP polishing pads, with a 25% year-on-year increase in consolidated semiconductor revenue in the first half of the year, rising to 66% of total revenue. Demand for Hard Pads and advanced packaging is strong, with a new Soft Pad line expected to begin trial production in the third quarter and gradually ramp up production in the fourth quarter, with products already applied in CoWoS and SoIC. Zhongsha holds CMP diamond discs and recycled wafers, reporting revenue of 2.49 billion yuan in the second quarter, a year-on-year increase of 17.9%, with gross margin rising to 40.1%, and shipments of 2-nanometer and 1.6-nanometer related diamond discs rapidly increasing.

hot_img The new AI chip company Etched faces skepticism: Behind the $21 billion valuation, performance has yet to be verified by a third party

AI chip startup Etched recently completed a $700 million financing round at a valuation of $21 billion, but its technology claims are facing industry skepticism. The well-known hacker George Hotz's AI computing team, the tiny corp, publicly criticized Etched's marketing approach: there are many investors, orders, and hardware photos, but there is too little third-party data to truly verify performance.Etched's core selling point is LVI (Low Voltage Inference) technology, claiming it allows trillion-parameter sparse MoE chips to run at over 80% of theoretical peak computing power (MFU). Chip design professional Wesley Yue raised technical doubts about this: high MFU does not necessarily represent absolute performance—if the chip's peak computing power is low, even with an 80% utilization rate, actual performance may still lag behind competitors. Yue believes that Etched's design "does not make sense from first principles" and may be a result of repackaging after its early Transformer ASIC faced power consumption issues.Etched has not yet disclosed complete computing power, power consumption, and third-party benchmark data; the official website only states that "early customer tests have reached leading levels," and detailed performance data will be "released later." There is currently no evidence to prove that Etched is fraudulent. Etched has not publicly responded to this matter.

hot_img TSMC's CoWoS orders are overflowing, and it is reported that Intel's Malaysia factory will support backend packaging

According to the Economic Daily, TSMC's advanced packaging CoWoS capacity is in short supply, and it has been reported that some backend orders have overflowed to Intel's factory in Malaysia, where Intel is assisting with packaging using part of its capacity to serve common major customers, breaking the past ecosystem competition norms. TSMC Chairman Wei Zhejia previously stated at a conference call that TSMC focuses on advanced packaging in the frontend and welcomes "more manufacturers to supply capacity" for the shortage in the backend, providing flexible alternatives for common customers.The report points out that the bottleneck in advanced packaging capacity mainly lies in the backend ramp-up speed being lower than that of the frontend process, and the widening gap in CoWoS capacity has forced orders to overflow. SemiAnalysis Chipbook data shows that approximately $1.3 billion worth of HBM has been shipped to Malaysia, and industry analysis indicates that Intel's local factory should already have the capability for large-scale HBM integration. Intel CEO Pat Gelsinger stated that the EMIB-T technology is ensuring reliable yield, and in the context of insufficient CoWoS capacity, "Intel is in a unique position to provide support." Companies with overlapping supply chains such as Unimicron, ASE Technology Holding, and Jiadeng are expected to benefit simultaneously, with Unimicron's stock price rising over 7% on that day. Intel's EMIB-T related applications are targeted for mass production by 2027.
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