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Flash

first_img Cross-chain stablecoin bridge Cashmere announced its roadmap, which will launch Mountain and the token $CSM

Cross-chain stablecoin bridge Cashmere announces expansion plans, with the automated liquidity product Goat LP set to open to all users, followed by the launch of the main product Mountain and the token $CSM. Cashmere Bridge currently supports zero-slippage stablecoin transfers across 16 chains, and Goat Street features 6,666 goat NFTs on the Robinhood Chain. The team states that there is currently no official $CSM, and the related arrangements are part of the current plan and may change.Goat LP targets Uniswap v3 and v4 positions on the Robinhood Chain, with positions remaining in users' wallets as Uniswap NFTs. Automatic reinvestment incurs a 10% reinvestment fee, with Gas covered by the project team; automatic adjustment of ranges and automatic exits both incur a 0.15% fee. The official description refers to it as experimental software. The Mountain code has completed testing and will undergo external auditing before going live. Barn is a soulbound NFT with a maximum of 10 slots, and after issuance begins, new $CSM will be distributed every second. Goat NFTs can be permanently bound to receive issuance shares and cannot be sold or withdrawn after binding.The plan is to issue 1,000 founding Barns, with a guaranteed slot price of 0.125 ETH, whitelist at 0.25 ETH, and public auction prices dropping from 1.5 ETH to 0.25 ETH. $CSM will begin trading through the official Uniswap v4 ETH pool, while market making and tokens on Anvil have been canceled and redeployed due to technical issues. The maximum supply is planned at 666 million, with 10% allocated for official pool liquidity, 25% for the team and treasury with designated ownership, and 65% issued as the system operates. The team also plans to airdrop to Barn participants, Goat Street activators, and early users, with wallets that have listed goat NFTs on OpenSea being excluded.

first_img Japan approves TSMC Kumamoto Factory No. 2 to produce 3-nanometer chips, expected to start production in 2028

According to the Industrial and Commercial Times, Japan's Ministry of Economy, Trade and Industry has approved TSMC's first phase plan for the production of advanced semiconductors using 3-nanometer process at its second factory in Kumamoto Prefecture. This will be the first time a manufacturer in Japan produces 3-nanometer chips. TSMC can further expand its production capacity based on additional support from the Japanese government. Kumamoto Prefectural Governor Seiji Kimura stated that this plan will drive a new wave of creative revitalization.The Nikkei reported that the Ministry of Economy has listed the Kumamoto second factory as a recipient of subsidies, with plans to produce 3-nanometer chips, expected to officially start production in December 2028, with final capacity depending on the amount of subsidies. The Ministry will include the budget needed for subsidies in the fiscal year 2027 budget request, with the Japanese government originally planning to provide 732 billion yen in subsidies. The Asahi Shimbun pointed out that the Kumamoto second factory is still under construction and is adjacent to the already operational Kumamoto first factory.Previously, TSMC planned for the second factory to manufacture 6-nanometer and 12-nanometer processes, with a monthly capacity of 48,000 wafers, and planned to produce 40-nanometer chips; in February this year, the plan was changed to 3-nanometer, reducing the monthly capacity to 6,000 wafers. The adjustment plan for the Kumamoto first factory was also approved by the Ministry, with the original plan to produce 55,000 wafers per month covering 22 to 28 nanometers and 12 to 16 nanometers, while the new plan stops production of 12 to 16 nanometers, changing to 45,000 wafers per month for 22 to 28 nanometers.

first_img Jumpspace released the STEPX Neo smartphone, with an AI intelligent entity built into the operating system

StepFun, an AI startup invested by Tencent, has released the STEPX Neo phone, which features an AI intelligent agent directly built into the operating system rather than as an external application. The phone began pre-sales on the evening of October 13, priced at 3999 yuan (approximately 560 USD), with its official sale starting on October 16. Pre-sale channels include JD.com, Tmall, and Douyin. Users do not need to open a ride-hailing app to input addresses and select vehicles; they simply need to inform the destination, and the intelligent agent can autonomously complete the subsequent steps. StepFun stated at the launch event that in the era of intelligent agents, AI is no longer an additional feature of smartphones but is the product itself.The device runs on the Step AOS 1 system, which the company claims is designed from the ground up for intelligent agents, featuring long-term memory, task scheduling, and security control capabilities, composed of a mix of Android, Linux, and real-time operating system components. The system uses the MCP protocol to break down functions such as messages, applications, files, and settings into small modules that can be directly called by the intelligent agent, giving users two entry points: a traditional application grid and an intelligent agent space. The intelligent agent is named Amoo, which saves two types of memory: user factual preferences and task execution experiences. Simple commands are processed by a small model on the device, some of which can run offline, while complex cross-application requests are handled by a large model in the cloud. A second MiniLED screen on the back of the device can display Amoo's execution status.Nearly 100 companies and products, including Alipay, Tencent, Trip.com, Didi, and Meituan, have integrated with Amoo. Payments, travel bookings, and content creation are still completed by their respective platforms. This is an alternative path for StepFun in response to the major application blockages faced by ByteDance's Doubao, which previously used screen reading and simulated clicking solutions. StepFun was founded in 2023 by former Microsoft Vice President Jiang Daxin. Its self-developed flagship large model, Step 5 Preview, was launched in September, with a parameter scale of 600 billion and a single activation of 27 billion, supporting a context of 1 million tokens; the earlier released Step 3.5 Flash was open-sourced under the Apache 2 license. The price of 3999 yuan includes a 12-month STEPX Token plan, providing 100 billion tokens per month, while the AI costs after the first year have not yet been announced.

first_img Anthropic opens employee access to METR, advancing independent security assessments

On October 15, Anthropic announced that it has begun providing employee-like access to a team from the nonprofit organization METR for the purpose of evaluating its models and safety practices. The company stated that last month it committed to strengthening independent third-party evaluations and signed the White House "Superintelligence Agreement," which includes a commitment to collaborate with independent external auditors or evaluators. Over the past year, Anthropic has worked with METR to review several risk reports, and METR will publish its risk assessment results.Anthropic has equipped six METR employees with company hardware, office space, and access to internal tools and systems roughly equivalent to those of its own risk assessment team. With a few explicitly defined categories such as client data, attorney-client privileged information, and model architecture information, employees are encouraged to share information as they would with colleagues working on alignment risk. METR may publish analyses of risk levels, events, or practices, which Anthropic cannot veto, but can request the removal of pre-defined narrow category information; METR may publicly state the circumstances of redaction and indicate whether it believes the redaction is reasonable without disclosing the content that was redacted. This arrangement is limited to small teams working under enforceable agreements, and other METR employees are isolated from working with this team.Anthropic is also collaborating with SecureBio and Accenture on assessments and is in early discussions with other organizations, including Hugging Face. SecureBio is reviewing the chemical and biological weapons section of the August 2026 risk report, having previously completed and published a pilot review of the previous risk report.

first_img SemiAnalysis: ASML is currently developing hybrid bonding equipment

On October 15, the semiconductor research organization SemiAnalysis published an article stating that the lithography equipment manufacturer ASML has not officially announced related products, but patents, news reports, and the company's roadmap all indicate that it is developing hybrid bonding equipment. The author of the article judges that ASML may first launch more challenging chip-to-wafer hybrid bonding tools and view it as an extension of vertical integration.Patents show that the system operates on a track, with each chip placed in an independent carrier, sequentially completing inspection, cleaning, plasma activation, morphology inspection, leveling, coarse alignment, position adjustment, and fine alignment before entering the bonding station; the final placement is completed by the carrier and suction cup. The track's repeat accuracy is about 10 microns, far from the approximately 50 nanometers required for bonding. ASML submitted 27 bonding patent families from December 2022 to November 2024, most of which are aimed at chip-to-wafer. The Elec reported in March that ASML has begun hybrid bonding machine architecture design with Prodrive Technologies and VDL ETG.The article states that wafer-to-wafer hybrid bonding has been used for image sensors and 3D NAND; chip-to-wafer is currently only used for mass production of logic chips, including AMD's hybrid bonding V-Cache shipped since 2022 and TSMC's SoIC. The current spacing of SoIC is about 6 microns, with a target of reaching approximately 4.5 microns by 2029. Besi is currently the only supplier with chip-to-wafer mass production tools, with related logic business mainly concentrated in TSMC and Intel.

first_img Samsung Electronics lowers the production of mid-range and low-end smartphones in the fourth quarter, as the supply of PCB raw materials is hindered

According to a report by ZDNet Korea on October 15, Samsung Electronics has lowered its production plan for mid-range and low-end smartphones in the fourth quarter. The reasons include rising prices of memory chips and disruptions in the supply of glass fiber used in PCB raw materials CCL. Japan's Nitto Denko is shifting more production capacity towards T-glass for AI semiconductors, reducing the output of E-glass for smartphone PCBs, leading to supply shortages and price increases. E-glass is used in semi-cured sheets for smartphone motherboards HDI and RFPCB.The report states that after the rise in storage prices increased manufacturing costs, Samsung reduced orders for related components. Models like the Galaxy A have lower profitability, making it difficult to significantly increase production. This year, the prices of basic mid-range models have risen by more than 100,000 Korean Won compared to the previous generation. The outlook for component orders communicated to partners for the fourth quarter corresponds to an annual smartphone shipment volume of just over 230 million units, which is below the component industry's expectation of 240 million units and represents a decrease of 20% to 30% compared to before the Mid-Autumn Festival holiday. Plans for the mobile business next year have not been shared with partners as in previous years.The monthly production outlook for the fourth quarter in mid-September was 14.3 million units in October, 9.5 million units in November, and 7.6 million units in December, totaling 31.4 million units. This was adjusted at the beginning of this month to 9.9 million units in October, 7.6 million units in November, and 6.7 million units in December, totaling 24.2 million units, a reduction of 23%. While the production of mid-range and low-end models has been lowered, the shipment plans for flagship models like the Galaxy S27 at the beginning of next year remain at a high level, and the shipment volume for foldable phones is also planned to increase. The MX and Network divisions reported a loss of 735 billion Korean Won in the second quarter, with the securities industry projecting an annual loss of 400 billion Korean Won.

first_img Backbone Labs bOSMO contract vulnerability leads to support exhaustion, Osmosis announces compensation plan

The liquid staking token bOSMO issued by Backbone Labs nearly exhausted its contract support after a large redemption in the Osmosis community pool. A disclosure on the Osmosis forum on October 15 revealed that approximately 40,508 OSMO were designated for compensation to 1,037 accounts. The disclosure author Johnny Wyles stated that the staking contract has overpaid for each redemption since at least April 2026, settling at approximately 1.676 OSMO per bOSMO, while the declared exchange rate of the contract was about 1.117 OSMO.The vulnerability repeatedly counted the OSMO staked on Backbone's own validators, allowing redeemers to receive about 50% more assets, at the cost of diluting the support for remaining holders. The defect was exposed when preparing to liquidate the community pool position, and the passed governance proposal 1049 authorized the withdrawal of the Margined managed treasury position and the destruction of the reclaimed OSMO when it ceased managing liquidity operations. The pool's bOSMO treasury holds approximately 1.137 million bOSMO, accounting for about 97% of the total supply of the token; the redemption transaction executed on October 9 at 21:59 ET destroyed 776,000 bOSMO and began unbinding approximately 1.3 million OSMO.Compensation is based on the qualified balance at block 72,237,940, calculated at 1.1174 OSMO per bOSMO. bOSMO purchased after the snapshot is not included in the compensation, and underlying holders in the liquidity pool and other contracts are also included;
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