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first_img Analysis: China's storage is divided among CXMT, YMTC, and XMC

Researcher Schulz_Research stated that China's storage advancement is no longer a story of a single company, but rather a division of labor among three companies: CXMT is responsible for DRAM wafers, YMTC is responsible for NAND and has added DRAM in its latest factory, and the foundry controlled by YMTC, XMC, is responsible for stacking products from both. This division corresponds to the rules set by Beijing since late December last year, which state that new factory approvals must show that at least half of the equipment is domestically sourced, with exemptions only granted when there are no domestic options available. YMTC's Wuhan Phase III is the first advanced storage project to pass this rule and is set to begin production later this year.CXMT operates three 300mm DRAM factories, each producing about 100,000 wafers per month; models indicate it will reach 350,000 wafers by the end of 2026, and if all announced projects are completed, the total will exceed 600,000 wafers. YMTC's first two factories in Wuhan have a combined capacity of 200,000 wafers, with Phase III expected to reach 50,000 wafers by 2027 and full production of 100,000 wafers, along with plans to build two more factories of similar scale. XMC has two 12-inch factories, each with about 30,000 wafers, and an HBM packaging line producing about 3,000 wafers per month. China supplies about 10% of the global DRAM bits, with YMTC accounting for 14% of NAND bit shipments in the second quarter, and China consumes about 30% of global storage.CXMT has begun mass production of DDR5 and LPDDR5 and plans to start mass production of HBM3 this year, having already sent samples to domestic AI hardware developers. XMC has spent two years building HBM packaging based on hybrid bonding and YMTC's stacking IP, and is still advancing TSV technology.

Serenity: The storage prices and supply-demand structure remain tight, and a short-term increase does not indicate that the bottleneck has been broken

Serenity posted a reminder that the fundamentals of storage shortages have not changed and may even become more acute. The market will shift from one bottleneck sector to another, but the companies themselves remain unchanged; what changes are the valuations and narratives. Serenity added several pieces of evidence suggesting that the storage supply-demand gap may be worse than the market expects: Nikkei reported that Japanese distributors claim the storage demand gap has reached 40% to 60%, and prices may rise by about 50% by the end of the year; SpaceX has not accounted for the approximately $1.3 trillion capital expenditure from ultra-large cloud providers, and total spending may exceed expectations; SanDisk's expected gross margin of 80% is expected to be maintained until 2030; and order visibility for companies like Samsung has extended to 2031.Serenity emphasized that storage stocks are highly volatile, with some of its positions showing unrealized gains of over 270%, making them easier to hold. However, the company's operational fundamentals and short-term stock prices often do not align. The same logic applies to other bottleneck areas such as optical modules, CW lasers, and substrates; after a rebound in stock prices, there is no need to assume that shortages have ended. Storage prices and supply-demand structures remain tight, and market sentiment and valuation narratives are rapidly rotating.

The Central Cyberspace Administration and six other departments issued a plan for digital and green collaborative transformation

The Central Cyberspace Affairs Commission, the National Development and Reform Commission, the Ministry of Industry and Information Technology, the Ministry of Ecology and Environment, the Ministry of Housing and Urban-Rural Development, the Ministry of Agriculture and Rural Affairs, and the Ministry of Commerce jointly issued the "Implementation Plan for Promoting Coordinated Transformation and Development of Digitalization and Greening (2026-2030)", proposing to advance the coordinated transformation of digitalization and greening during the "14th Five-Year Plan" period.The plan emphasizes empowering green and low-carbon transformation with digital intelligence technology, achieving low-cost and high-efficiency applications of artificial intelligence by 2030, significantly improving the energy efficiency of computing facilities and 5G base stations, promoting renewable energy electricity consumption in key areas such as computing facilities to reach the responsibility weight level of the respective provinces, and deepening the digital and green applications in agriculture, manufacturing, trade, consumption, and urban operation, strengthening intelligent governance of the ecological environment and digital carbon management, and solidifying the foundation for coordinated dual transformation and international cooperation.

first_img Dubai VARA signed a memorandum of understanding with Securitize to advance tokenization innovation

According to Cointelegraph, the Dubai Virtual Assets Regulatory Authority (VARA) has signed a Memorandum of Understanding (MoU) with the BlackRock-backed tokenization platform Securitize to advance the tokenization and digital asset infrastructure development in the UAE and Dubai. Both parties stated that the agreement will establish a collaborative framework to support regulated tokenization initiatives, promote institutional participation, and strengthen Dubai's digital asset ecosystem.A VARA spokesperson stated that the memorandum aims to combine VARA's regulatory perspective with Securitize's experience in institutional tokenization to determine how the collaboration can help Dubai develop a trustworthy and regulated tokenization market, with no specific projects to be announced at this stage. Carlos Domingo, co-founder and CEO of Securitize, stated that Dubai is one of the most forward-looking jurisdictions for global digital asset innovation, and collaborating with regulators is crucial for tokenization to move from concept to mainstream financial infrastructure.At the time of this announcement, investor demand for tokenized assets continues to rise. According to RWA.xyz data, the total number of tokenized asset holders has increased by 103% over the past 30 days to 3.2 million, and the total value of tokenized assets has grown by 2% to $38.5 billion. Securitize is currently the largest tokenization platform globally, with a tokenized asset management scale of $4.9 billion, while Ondo Finance ranks second with $3.5 billion.

first_img Delphi Digital: China's AI Laboratory is Transforming Intelligent Economics

Research institution Delphi Digital stated that hardware limitations are driving Chinese laboratories to shift towards cheaper models and more efficient technology stacks. Export control restrictions limit their access to advanced chips, while domestic accelerators can handle inference, but cutting-edge training remains difficult to achieve. Chinese laboratories are innovating in system efficiency, model architecture, training data, and reinforcement learning. DeepSeek has found a way to avoid GPU idle data movement, and ByteDance and Moonshot are set to release similar versions within months.In terms of architecture, training is shifting to cheaper digital formats that are compatible with domestic chips. Sparse architectures reduce the runtime per token, and the attention mechanism has been redesigned three times to control the memory costs of long context. In terms of data, denser prediction targets and better optimizers enhance the learning signal per token. In reinforcement learning, DeepSeek's GRPO has become the default recipe, with ByteDance, Alibaba, and MiniMax each launching successor plans within a year. Chinese models are now among the lowest-cost cutting-edge adjacent systems.On OpenRouter, the proportion of token consumption by Chinese developed models is expected to rise from less than 1.2% at the end of 2024 to the majority by 2026. The Chinese AI market is experiencing a price war from 2024 to early 2026, with several laboratories implying revenue multiples of about 47-117 times, while Anthropic and OpenAI are around 15-21 times. Huawei's Ascend chips are currently available for inference, and DeepSeek reportedly attempted to train R2 on Ascend but returned to NVIDIA after encountering technical issues. Domestic accelerator supply remains below estimated demand.

first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.
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