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first_img SemiAnalysis: ASML is currently developing hybrid bonding equipment

On October 15, the semiconductor research organization SemiAnalysis published an article stating that the lithography equipment manufacturer ASML has not officially announced related products, but patents, news reports, and the company's roadmap all indicate that it is developing hybrid bonding equipment. The author of the article judges that ASML may first launch more challenging chip-to-wafer hybrid bonding tools and view it as an extension of vertical integration.Patents show that the system operates on a track, with each chip placed in an independent carrier, sequentially completing inspection, cleaning, plasma activation, morphology inspection, leveling, coarse alignment, position adjustment, and fine alignment before entering the bonding station; the final placement is completed by the carrier and suction cup. The track's repeat accuracy is about 10 microns, far from the approximately 50 nanometers required for bonding. ASML submitted 27 bonding patent families from December 2022 to November 2024, most of which are aimed at chip-to-wafer. The Elec reported in March that ASML has begun hybrid bonding machine architecture design with Prodrive Technologies and VDL ETG.The article states that wafer-to-wafer hybrid bonding has been used for image sensors and 3D NAND; chip-to-wafer is currently only used for mass production of logic chips, including AMD's hybrid bonding V-Cache shipped since 2022 and TSMC's SoIC. The current spacing of SoIC is about 6 microns, with a target of reaching approximately 4.5 microns by 2029. Besi is currently the only supplier with chip-to-wafer mass production tools, with related logic business mainly concentrated in TSMC and Intel.

first_img ASML will announce its third-quarter financial report, and the market expects profits to nearly double

Dutch semiconductor equipment manufacturer ASML is expected to announce its Q3 financial report on October 14. Driven by demand for AI chips, the market anticipates significant growth in revenue and profits compared to the same period in 2025. Wall Street analysts estimate Q3 revenue at 11.73 billion euros, a year-on-year increase of 55%; earnings per share are projected to be 10.76 euros, nearly doubling from 5.49 euros in Q3 2025.ASML's Q2 revenue was 9.3 billion euros, higher than 7.7 billion euros in the same period of 2025, with net profit increasing from 2.3 billion euros to 2.9 billion euros. The company estimates Q3 revenue to be between 11 billion and 12 billion euros, with a gross margin of 55% to 57%, and has raised its full-year revenue outlook to between 43 billion and 45 billion euros.ASML is the only manufacturer in the world that commercializes extreme ultraviolet lithography equipment. Foundries such as TSMC, Intel, and Samsung rely on its equipment to manufacture advanced AI processors, and the company is also developing the next generation of High-NA EUV. Intel has processed over 1 million wafers using this equipment in research, testing, and manufacturing, while Samsung plans to introduce it into advanced DRAM mass production by 2028. The market expects ASML to increase the capacity of its existing EUV systems by about 30% by 2027.
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