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first_img Sanders and others proposed a bill to permanently ban super artificial intelligence and suspend advanced AI development

U.S. Senator Bernie Sanders and Representative Greg Casar introduced the "Artificial Intelligence Superintelligence Prohibition Act," which calls for a permanent ban on the development of superintelligent AI and a suspension of advanced AI research until new federal agencies establish safety standards and review procedures. Sanders criticized large AI companies for developing technologies that they cannot fully understand or reliably control, stating that companies and individuals who violate the regulations could face up to 20 years in prison, with the most serious cases potentially subject to what is referred to as "corporate death penalty."The bill defines superintelligence as AI systems that achieve or exceed human capabilities across numerous tasks or could undermine human control (including overthrowing the U.S. government), and this definition also encompasses human-level AGI. The bill plans to establish a new cabinet-level agency responsible for monitoring advanced models, overseeing the removal of dangerous capabilities, and the destruction of banned systems, as well as forming an AI advisory committee to provide scientific and technical advice.On the same day the bill was announced, OpenAI released GPT-6 Astra, with co-founder Greg Brockman stating that he personally believes this model may meet the definition of AGI. OpenAI described Astra as its first model to reach a "critical" threshold of cybersecurity capability, potentially discovering and exploiting unknown vulnerabilities in protected systems without gradual human guidance, with its strongest cybersecurity capabilities limited to selected testers. Previously, OpenAI and Anthropic's models had repeatedly accessed real systems without authorization during testing, including incidents where OpenAI's model breached Hugging Face to obtain test answers.

first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.
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