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BTC $79,818.06 +0.15%
ETH $2,481.84 +1.17%
BNB $765.89 +6.28%
XRP $1.42 +1.19%
SOL $103.33 +1.44%
TRX $0.3340 +0.80%
DOGE $0.0898 +6.18%
ADA $0.2193 +3.99%
BCH $256.98 +3.85%
LINK $12.05 +3.67%
HYPE $85.35 +1.04%
AAVE $134.69 +3.42%
SUI $0.7964 +5.49%
XLM $0.1843 +2.81%
ZEC $1,026.17 +0.11%

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first_img Analysis: Japan's government bond yields hit a 30-year high, while Bitcoin is trading sideways at $78,000

According to Cointelegraph, the global bond bear market continues to ferment, with Japan's 10-year government bond yield rising to 3% on Tuesday, the first time since 1996; the 30-year government bond yield also broke through the historical high of 4.18%. The U.S. 10-year government bond yield simultaneously rose to a multi-year high of 4.78%, and global long-term sovereign bond yields are at their highest level since the 2008 financial crisis.In this context, Bitcoin remains in a sideways consolidation, maintaining around $78,000, slightly retreating from an earlier high of nearly $79,000. There is a dense resistance area between the current spot price and $86,000, which limits Bitcoin's upward momentum. Market sentiment remains cautiously optimistic in the short term, with the $76,000 to $82,000 range seen as a key battleground in the coming weeks.This round of selling occurred after U.S. Treasury Secretary Yellen announced an increase in the upper limit of government bond repurchase transactions to $4 billion starting in September, with some commentators likening it to a form of yield curve control. Arthur Hayes has long argued that the Federal Reserve will eventually activate the FIMA repo facility, a mechanism that will create new dollar liquidity, which is also why he recommends allocating Bitcoin, gold, and cryptocurrencies; Yellen hinted at the future use of this tool as early as August.

SK Hynix considers Intel as the next-generation HBM substrate chip supplier

According to Citrini analyst Jukan, SK Hynix is working on diversifying the foundry suppliers for the substrate chips used in high bandwidth memory (HBM), which are constructed by vertically stacking multiple memory chips. It is reported that the company is considering outsourcing part of the substrate chip production for the seventh generation HBM, namely HBM4E, to Intel's foundry. So far, SK Hynix has relied entirely on TSMC for outsourcing substrate chip production.This move is seen as an effort to establish a multi-supplier foundry strategy to reduce the concentration of the supply chain on TSMC while enhancing SK Hynix's bargaining power in pricing. According to industry insiders on August 31, SK Hynix is advancing a plan where the substrate chips for HBM4E may be jointly manufactured by TSMC and Intel, potentially starting from the HBM4E generation.As the market expects the cost burden of substrate chips for HBM4E to further increase. Since HBM products are mainly covered by long-term supply agreements (LTA), SK Hynix also finds it difficult to immediately pass on the higher foundry costs to customers by raising product prices. Therefore, industry observers believe that if Intel ultimately joins SK Hynix's substrate chip supply chain, the company will gain more options in terms of cost competitiveness and supply stability.
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