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first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.

first_img Former Hack VC partner Hsin-Ju accused the company of pressuring and retaliating, leading to a suicide attempt

Former Hack VC partner and platform head [Hsin-Ju](https://www.rootdata.com/zh/member/Hsin-Ju C.?k=MTUzMjc=) stated that he decided to refuse a settlement agreement that required him to remain silent, preferring to accept a $0 compensation, and has fired his lawyer. He plans to publicly disclose all evidence from his time at Hack VC on August 26 (Wednesday). Hsin-Ju mentioned that he has worked in the crypto industry for 9 years, having been employed at Stellar, Solana, and Fhenix, and that last year during his time at Hack VC, he repeatedly requested to leave due to severe medical emergencies (including Graves' disease, hyperthyroidism, and severe insomnia). However, he was threatened by partners that if he left before completing relevant meetings, he would be blacklisted in the industry, forcing him to work continuously under extreme pressure, which ultimately led to a suicide attempt.Hsin-Ju stated that after the suicide attempt, he expressed in writing that he had no intention to sue and only wished to leave without retaliation. However, Hack VC subsequently had issues with his COBRA health insurance for nearly 4 months, which were only resolved after a lawyer intervened. During the legal process, they continued to attempt to harm his interests through lawyers and employees. Currently, both parties' lawyers are prepared for private mediation and settlement, but he is unwilling to exchange silence for money and chooses to speak out. Hsin-Ju emphasized that he performed well during his employment, having received raises and bonuses, and that the lawsuit is not about money, fully aware that he may face adverse consequences when confronting an institution of $600-700 million scale.Hack VC responded that they are aware of the former employee's statement and express deep concern for his health, but there are significant differences in understanding of the events, and they are currently unwilling to publicly discuss details to respect his privacy.
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