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first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.

The temporary agreement framework for Hormuz has been reached, laying the foundation for the resumption of nuclear negotiations between the U.S. and Iran

According to the American media MS NOW, two Middle Eastern diplomats familiar with the negotiations stated that Oman has agreed to reach a framework agreement with Iran to temporarily reopen the Strait of Hormuz. An Iranian government official said that the agreement will establish a new shipping route by allowing commercial vessels to enter the Persian Gulf via Iranian-controlled routes and exit via Omani-controlled routes. The agreement does not include charging tolls for commercial vessels seeking safe passage through the waterway. This proposal is a "temporary agreement" that will lay the groundwork for Washington and Tehran to announce a new ceasefire and restart nuclear negotiations.According to Iranian officials, the United Nations International Maritime Organization and the United States will participate in the formal announcement of the agreement. A government official from a Gulf country stated that the arrangement has been recognized by the member states of the Gulf Cooperation Council. Officials have not disclosed when the agreement will be announced. However, whether the United States will support the management agreement for the strait will depend on the final details. An American official stated that Washington only supports a temporary agreement to reopen the strait on the premise of no tolls and unobstructed passage.
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