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first_img He Xiaopeng: Xpeng humanoid robot IRON will begin mass production at the end of the year

He Xiaopeng, Chairman of XPeng Inc., stated at the 2026 semi-annual financial report meeting that the humanoid robot IRON plans to enter large-scale production by the end of this year and will implement commercial scenarios in XPeng stores and parks. In 2027, IRON will officially launch, targeting external customers in the retail and service industries, with large-scale deliveries in China and overseas, and monthly production capacity can quickly increase to several thousand units. He has also served as the CEO of the robotics business since June of this year, integrating resources such as the automotive supply chain, automotive-grade manufacturing, global layout, and Turing AI chips to promote mass production and commercialization.On the same day, XPeng announced that its humanoid robot business has secured over $900 million in its first round of financing, with a post-investment valuation exceeding $6.3 billion. IDG led the investment, with Gao Rong Venture Capital, Tencent, Alibaba, and others subscribing for $600 million, while XPeng Inc. and senior executives including He Xiaopeng subscribed for $300 million. He Xiaopeng believes that the technical threshold for advanced general-purpose robotics is at least 20 times that of smart cars, and the revenue and gross profit over the entire lifecycle of a single unit will be significantly higher than that of cars, expecting considerable gross profit after mass production to support physical AI research and development.The pre-installed mass-produced Robotaxi equipped with the second-generation VLA has completed over 2,000 internal test orders in Guangzhou, and XPeng has completed the development of the cloud takeover platform, aiming to achieve passenger operations without safety personnel next year. The automotive business generated total revenue of 32.78 billion yuan in the first half of the year, delivering 166,000 vehicles, with a gross margin of 20.6%; it is expected to deliver between 115,000 and 121,000 vehicles in the third quarter, with total revenue between 21.7 billion and 23.4 billion yuan.

first_img Tomasz Tunguz: AI infrastructure exhibits a long tail effect, with bottlenecks gradually transmitting and driving up costs

Venture capitalist Tomasz Tunguz pointed out that the narrative of AI infrastructure resembles a slow relay race, with bottlenecks sequentially transmitting from GPUs to memory, CPUs, and storage, each link freezing the supply chain of the next for years and locking in higher baseline costs. At the beginning of 2023, the GPU shock caused H100 rental prices to exceed $9 per hour, and server shipments fell by 22%; subsequently, manufacturers shifted capacity to HBM, leading to an 80% quarterly increase in enterprise SSD prices and over a 60% rise in DRAM.By the end of 2025, the workload of intelligent agents will push the CPU to GPU ratio to about 1:1, with the average price of server CPUs rising by 27% year-on-year; in 2026, nearline HDD annual capacity will be sold out. The construction cost of data centers has risen to about $20 billion per gigawatt, with orders for long-cycle equipment such as transformers and turbines scheduled as far out as 2029 to 2031.Tunguz referred to this as the long whip effect in the hardware sector: years of manufacturing delays amplify downstream demand shocks upstream, and when pressure is relieved at a certain bottleneck, it will be delayed in transmitting to the next link, with transformers scheduled for delivery in 2027 to 2028, NAND wafer fabs, and turbine production lines potentially facing the risk of overcapacity.

hot_img Samsung Electronics plans to repurpose the NRD-K R&D production line for wafer foundry use, aiming for mass production of 2nm base chips for HBM

According to South Korean media ZDNet Korea, Samsung Electronics is adjusting the original purpose of its NRD-K Line 2 at the Giheung campus from a research and development facility to a wafer foundry line, with the main target product being the 2nm base chips required for NVIDIA's HBM. This production line is expected to be operational in the second half of 2028, adopting a "Send-Fab" model, which involves receiving wafers from other mass production lines and performing specific processes.NRD-K is the most advanced composite research and development campus built by Samsung Electronics to seize future semiconductor technology, with a total investment of approximately 20 trillion won, planning for three production lines, of which the first line is scheduled to be completed by the end of 2024. This adjustment aims to proactively respond to the expansion of HBM demand driven by investments in AI infrastructure. Samsung plans to first apply the 2nm process to custom HBM and HBM5 to maintain performance advantages.Industry insiders point out that the scale of NRD-K Line 2 is relatively small, making it suitable for operation in the Send-Fab format. However, there are still about two years until the production line is operational, and the final purpose may be adjusted again based on market conditions. Samsung had previously considered using this production line for DRAM production, but after modifications to the relevant plans this month, DRAM capacity will be more concentrated in the Pyeongtaek campus. Equipment procurement orders have not yet been officially issued.

hot_img NVIDIA's Feynman platform is expected to go into mass production in 2028, with TSMC's A16 and SoIC expanding production simultaneously

According to DIGITIMES, NVIDIA's next-generation AI platform Feynman aims for mass production in the second half of 2028, utilizing TSMC's A16 process and incorporating SoIC 3D stacking and CPO technology. The Rubin generation focuses on integrating multiple small chips with HBM, while Feynman further develops towards 3D small chips, SoIC, and CPO. The report indicates that TSMC is accelerating the construction of related production capacity, with the original plan for SoIC monthly capacity to reach 20,000 pieces by the end of 2026, now updated to a target of 50,000 pieces by the end of 2027.The construction progress of TSMC's Chiayi AP7 and Tainan AP8 is also accelerating, with AP7 planned in 8 phases. P1 and P2 have entered installation, P3 and P4 have obtained construction permits, and P5 to P8 are still in planning. In addition to mass-producing Apple-specific WMCM, the factory will configure SoIC, CoPoS, and CPO production lines according to customer demand. NVIDIA has rapidly shifted its R&D and supply chain resources to the Feynman platform, and the spillover effect of TSMC's advanced packaging orders continues to expand, with Siliconware becoming the main testing and packaging factory for NVIDIA's CoWoS and CPO orders. The NVLink interconnect bandwidth of NVIDIA's Feynman platform is expected to exceed 1 PB/s, further improving from Rubin Ultra's 520 TB/s. TSMC's COUPE technology integrates EIC and PIC in 3D through SoIC to form a light engine, advancing optoelectronic conversion from traditional circuit boards to the internal packaging structure. Since 2026, NVIDIA has invested over $40 billion in building the AI ecosystem, covering areas such as models, wafer manufacturing, data centers, and optical communications.
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