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first_img Samsung's 4-nanometer production capacity is more than half used for HBM4 substrate chips

Samsung Electronics' wafer foundry division has recently surpassed 50% in the allocation of production capacity for the sixth-generation high bandwidth memory HBM4 substrate chips in the 4-nanometer process. The industry states that this division will invest more than half of its 4-nanometer wafers into HBM4 substrate chip manufacturing in the second half of this year to expand supply to companies like NVIDIA, Broadcom, and AMD.Samsung initiated mass production and shipment of HBM4 in February this year and plans to increase supply starting from the third quarter, significantly increasing the related wafer input since mid-year. This chip is based on Samsung's wafer foundry 4-nanometer (SF4) process. As of last month, over 50% of its total 4-nanometer capacity has been allocated to HBM4 substrate chips. According to insiders, Samsung's 4-nanometer process is currently at full capacity, with HBM4 substrate chips accounting for about 50% to 60%, and this high proportion will be maintained in the second half of the year.Samsung's wafer foundry production lines at Pyeongtaek Plant 2 and Plant 3 are mass-producing processes ranging from 4 to 7 nanometers, with a monthly capacity of about 30,000 wafers for the 4-nanometer process. Based on this, the wafer input related to HBM4 substrate chips is estimated to be about 15,000 wafers per month. During the second quarter earnings call, Samsung stated that it expects HBM4 revenue to increase more than threefold quarter-over-quarter in the third quarter, with HBM4 revenue in the second half expected to exceed 60% of the company's overall HBM revenue.

first_img Micron plans to expand HBM production capacity to approximately 100,000 wafers per month by the end of the year

According to Electronic News on September 3, Micron plans to double its high bandwidth memory (HBM) production capacity compared to last year, with a maximum addition of 60,000 wafers per month by the end of this year. Insiders say that Micron's HBM output was about 40,000 to 50,000 wafers per month last year, and it is expected to reach about 100,000 wafers per month by the end of the year, narrowing the gap with Samsung Electronics and SK Hynix.Micron is increasing procurement orders from multiple HBM equipment suppliers, with production bases mainly in Taiwan and Singapore, continuously introducing equipment. Currently, the output is mainly HBM3E 12-layer, with HBM4 12-layer accounting for about 20% to 30% at the beginning of this year, which may rise to as high as 50% by the end of the year. HBM4 12-layer will be used in NVIDIA's latest AI accelerator, Vera Rubin, and Micron has started mass production of this product since the second quarter of this year.Micron CEO Mehrotra stated in the Q3 earnings call for fiscal year 2026 in June this year that the ramp-up speed of HBM4 12-layer mass production is about twice that of HBM3E 12-layer, and cumulative revenue from HBM4 shipments has exceeded $1 billion. The industry believes that Samsung and SK Hynix each have HBM production capacities of about 150,000 to 200,000 wafers per month. Counterpoint data shows that in Q2 of this year, the global HBM market shares were SK Hynix 50%, Samsung 32%, and Micron 18%. Micron is also preparing related investments in Hiroshima, Japan.

hot_img UBS: It will be difficult for China to develop EUV lithography equipment comparable to ASML's top-tier products within the next ten years; mass production of DUV may take two to five years

According to Bloomberg, UBS analysts expect that China's semiconductor manufacturing capabilities may struggle to make sufficient progress in the next decade to develop solutions that can truly replace ASML's cutting-edge EUV lithography technology. UBS analysts wrote in their report, "The stage they are currently at seems comparable to ASML's in 2004." Based on patent application activities, especially in the fields of light sources and laser subsystems, China's current technological maturity is roughly equivalent to ASML's level 15 years before it began mass production of EUV equipment.UBS also expects that China is likely to have the capability for mass production of immersion DUV lithography machines within the next two to five years. Although immersion DUV is not as advanced as EUV, it remains an indispensable tool in chip manufacturing. ASML's immersion DUV machines are priced at nearly $90 million, while EUV equipment costs over $200 million each. China is one of ASML's largest markets, but due to export restrictions, ASML is prohibited from selling EUV equipment to China. UBS pointed out that considering the yield and capacity gaps and regulatory restrictions, Chinese lithography equipment is unlikely to be applied overseas. An ASML spokesperson did not respond to requests for comment. The report is based on UBS analysts' predictive views, and actual progress will depend on industry dynamics.

The Ontology mainnet has suspended block production due to a security review, and user assets have not been affected

According to the Ontology blog, its core development team discovered potential security vulnerabilities during routine security checks. Due to a high emphasis on the security and integrity of the mainnet, Ontology has immediately suspended block production on the Ontology mainnet to allow the technical team and validators to conduct a comprehensive security review of the network and related components. Ontology stated that no security incidents have been confirmed at this time, and there are no indications that user assets have been lost or stolen. ONT, ONG, and other on-chain assets are currently assessed to be unaffected; this suspension is a preventive security measure rather than a response to confirmed asset losses or ongoing attacks.During the review period, block production will remain suspended, and on-chain transactions cannot be processed. Users do not need to transfer or take any action regarding their ONT, ONG, and other on-chain assets, but should avoid conducting time-sensitive on-chain transactions until the network officially confirms its restoration. The duration of the suspension has not yet been determined, and the team will prioritize the comprehensiveness of the security review over speed; block production will not resume until the network has been thoroughly assessed and confirmed to be secure. The Ontology team is collaborating with validators and ecosystem partners to address this matter and will update progress through official channels, with a separate announcement to be made before and after the network restoration.

first_img Better launches Bitcoin-backed mortgage product with Coinbase

Better Mortgage and Coinbase announced the full launch of their Bitcoin-backed mortgage product, allowing U.S. homebuyers to use Bitcoin as collateral for a down payment without having to sell it. This product combines Fannie Mae-supported home loans with independently secured down payment loans backed by Bitcoin, requiring borrowers to pledge Bitcoin worth at least 250% of the down payment loan. The pledged assets will be held in a Better custodial account on Coinbase Prime.Both loans enjoy the same interest rate and amortization period, repaid through a single monthly payment; the pledged Bitcoin will be returned after the mortgage is fully paid off or refinanced. A drop in Bitcoin prices will not trigger a margin call or change the loan terms, but if the borrower is 60 days overdue, Better has the right to liquidate the pledged Bitcoin. Borrowers must be U.S. residents and hold a verified Coinbase account, and Coinbase One members can enjoy up to $10,000 in 1% cashback.This product was first announced in March of this year and opened for early experience. Previously, the Federal Housing Finance Agency directed Fannie Mae and Freddie Mac in June 2025 to study the incorporation of cryptocurrencies into mortgage risk assessments; mortgage lender Newrez also announced in January that it would recognize certain cryptocurrency assets when evaluating mortgage applications starting in February.
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